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参数资料
| 型号： | ZL9101EVAL1Z |
| 厂商： | Intersil |
| 文件页数： | 15/19页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD 1 ZL9101 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 0.6 ~ 4 V |
| 电流 - 输出： | 12A |
| 输入电压： | 12V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 615kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ZL9101 |
ZL9101M
Thermal Considerations
Experimental power loss curves along with θ JA from thermal
modeling analysis can be used to evaluate the thermal
consideration for the module. The derating curves are derived
from the maximum power allowed while maintaining the
temperature below the maximum junction temperature of
+125°C. In actual application, other heat sources and design
margin should be considered.
Package Description
The structure of the ZL9101M belongs to the Quad Flat-pack
No-lead package (QFN). This kind of package has advantages,
such as good thermal and electrical conductivity, low weight and
small size. The QFN package is applicable for surface mounting
technology and is being more readily used in the industry. The
ZL9101M contains several types of devices, including resistors,
capacitors, inductors and control ICs. The ZL9101M is a copper
lead-frame based package with exposed copper thermal pads,
which have good electrical and thermal conductivity. The copper
lead frame and multi component assembly is overmolded with
polymer mold compound to protect these devices.
The package outline and typical PCB layout pattern design and
typical stencil pattern design are shown on the second page of
the package outline drawing L21.15x15 on page 18. The module
has a small size of 15mm x 15mm x 3.5mm. Figure 17 shows
typical reflow profile parameters. These guidelines are general
prevent solder bridging between adjacent I/O lands. To reduce
solder paste volume on the larger thermal lands, it is
recommended that an array of smaller apertures be used instead
of one large aperture. It is recommended that the stencil printing
area cover 50% to 80% of the PCB layout pattern. A typical solder
stencil pattern is shown on the second page of the Package
Outline Drawing L21.15x15 on page 18. The gap width between
pad to pad is 0.6mm. The user should consider the symmetry of
the whole stencil pattern when designing its pads. A laser cut,
stainless steel stencil with electropolished trapezoidal walls is
recommended. Electropolishing “smooths” the aperture walls
resulting in reduced surface friction and better paste release which
reduces voids. Using a Trapezoidal Section Aperture (TSA) also
promotes paste release and forms a "brick like" paste deposit that
assists in firm component placement. A 0.1mm to 0.15mm stencil
thickness is recommended for this large pitch (1.3mm) QFN.
Reflow Parameters
Due to the low mount height of the QFN, "No Clean" Type 3 solder
paste per ANSI/J-STD-005 is recommended. Nitrogen purge is
also recommended during reflow. A system board reflow profile
depends on the thermal mass of the entire populated board, so it
is not practical to define a specific soldering profile just for the
QFN. The profile given in Figure 17 is provided as a guideline, to
be customized for varying manufacturing practices and
applications.
design rules. Users could modify parameters according to their
application.
PCB Layout Pattern Design
The bottom of ZL9101M is a lead-frame footprint, which is
attached to the PCB by surface mounting process. The PCB
layout pattern is shown on the second page of the Package
Outline Drawing L21.15x15 on page 18. The PCB layout pattern is
essentially 1:1 with the QFN exposed pad and I/O termination
dimensions, except for the PCB lands being a slightly extended
distance of 0.2mm (0.4mm max) longer than the QFN
terminations, which allows for solder filleting around the
periphery of the package. This ensures a more complete and
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150
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PEAK TEMPERATURE ~+245°C;
TYPICALLY 60s-150s ABOVE +217°C
KEEP LESS THAN 30s WITHIN 5°C OF PEAK TEMP.
SLOW RAMP (3°C/s MAX)
AND SOAK FROM +150°C
TO +200°C FOR 60s~180s
RAMP RATE ≤ 1.5°C FROM +70°C TO +90°C
inspectable solder joint. The thermal lands on the PCB layout
should match 1:1 with the package exposed die pads.
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350
Thermal Vias
A grid of 1.0mm to 1.2mm pitch thermal vias, which drops down
and connects to buried copper plane(s), should be placed under the
thermal land. The vias should be about 0.3mm to 0.33mm in
diameter with the barrel plated to about 1.0 ounce copper.
Although adding more vias (by decreasing via pitch) will improve
the thermal performance, diminishing returns will be seen as more
and more vias are added. Simply use as many vias as practical for
the thermal land size and your board design rules allow.
Stencil Pattern Design
Reflowed solder joints on the perimeter I/O lands should have
about a 50μm to 75μm (2mil to 3mil) standoff height. The solder
paste stencil design is the first step in developing optimized,
reliable solder joins. Stencil aperture size to land size ratio should
typically be 1:1. The aperture width may be reduced slightly to help
15
DURATION (s)
FIGURE 17. TYPICAL REFLOW PROFILE
FN7669.4
January 20, 2012
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZL9101M | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Digital DC/DC PMBus 12A Module |
| ZL9101M_11 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Digital DC/DC PMBus 12A Module |
| ZL9101M_1104 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Digital DC/DC PMBus 12A Module |
| ZL9101MIRZ | 功能描述:MODULE DGTL DC-DC 12A 21QFN RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:ZL9101M 标准包装:15 系列:Econoline REC3-DR 类型:隔离 输出数:2 电压 - 输入（最小）:4.5V 电压 - 输入（最大）:5.5V Voltage - Output 1:5V Voltage - Output 2:-5V Voltage - Output 3:- 电流 - 输出（最大）:300mA，300mA 电源（瓦） - 制造商系列:3W 电压 - 隔离:1kV（1000V） 特点:- 安装类型:表面贴装 封装/外壳:24-DIP SMD 模块（18 引线） 尺寸/尺寸:1.26" L x 0.80" W x 0.44" H（32.0mm x 20.3mm x 11.2mm） 包装:管件 工作温度:-40°C ~ 80°C 效率:75% 电源（瓦特）- 最大:3W 其它名称:10005457 |
| ZL9101MIRZ-T | 功能描述:DCDC DGTL PMBUS MODULE 12A 21QFN RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:ZL9101M 标准包装:10 系列:PT4570 类型:隔离 输出数:1 电压 - 输入（最小）:36V 电压 - 输入（最大）:75V Voltage - Output 1:9V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:3.3A 电源（瓦） - 制造商系列:30W 电压 - 隔离:1.5kV（1500V） 特点:- 安装类型:表面贴装 封装/外壳:19-SIP SMD 模块 尺寸/尺寸:3.00" L x 1.19" W x 0.50" H（76.2mm x 30.2mm x 12.7mm） 包装:托盘 工作温度:-40°C ~ 85°C 效率:84% 电源（瓦特）- 最大:30W |
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