参数资料
型号: ZXMN3A04DN8TC
厂商: Diodes Inc
文件页数: 2/7页
文件大小: 0K
描述: MOSFET DUAL N-CHAN 30V 8SOIC
标准包装: 2,500
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 20 毫欧 @ 12.6A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 36.8nC @ 10V
输入电容 (Ciss) @ Vds: 1890pF @ 15V
功率 - 最大: 1.25W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOP
包装: 带卷 (TR)
ZXMN3A04DN8
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
Drain-Source Voltage
Gate Source Voltage
Continuous Drain Current (V GS =10V; T A =25°C)(b)(d)
(V GS =10V; T A =70°C)(b)(d)
(V GS =10V; T A =25°C)(a)(d)
Pulsed Drain Current (c)
Continuous Source Current (Body Diode) (b)
Pulsed Source Current (Body Diode)(c)
Power Dissipation at T A =25°C (a)(d)
Linear Derating Factor
Power Dissipation at T A =25°C (a)(e)
Linear Derating Factor
Power Dissipation at T A =25°C (b)(d)
Linear Derating Factor
Operating and Storage Temperature Range
SYMBOL
V DSS
V GS
I D
I DM
I S
I SM
P D
P D
P D
T j :T stg
LIMIT
30
20
8.5
6.8
6.5
39
3.6
39
1.25
10
1.81
14.5
2.15
17.2
-55 to +150
UNIT
V
V
A
A
A
A
W
mW/°C
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)(d)
Junction to Ambient (b)(e)
Junction to Ambient (b)(d)
SYMBOL
R θ JA
R θ JA
R θ JA
VALUE
100
69
58
UNIT
°C/W
°C/W
°C/W
Notes
(a) For a dual device surface mounted on 25mm x 25mm FR4 PCB with coverage of single sided 1oz copper in still air conditions.
(b) For a dual device surface mounted on FR4 PCB measured at t
10 sec.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300μs - pulse width limited by maximum junction temperature. Refer to Trnsient
Thermal Impedance Graph.
(d) For a dual device with one active die.
ISSUE 2 - OCTOBER 2002
2
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