参数资料
| 型号： | 125700D00000G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 30/116页 |
| 文件大小： | 0K |
| 描述： | SOLDER ANCHOR FOR BGA HEATSINKS |
| 标准包装： | 1,000 |
| 附件类型： | 焊锚（需要 2 个） |
| 适用于相关产品： | BGA 散热片 |
| 产品目录页面： | 2673 (CN2011-ZH PDF) |
| 其它名称： | HS400 |
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20
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5801
Slide on heat sink with staggered fins
attaches to 8 pin DIP packages quickly and
easily. The heat sink features double spring
action and locking catch to firmly attach
the device creating a thermal conduction
path on both the top and bottom surfaces.
Available in two finishes.
10.54
(0.415)
14.27
(0.562)
5.33
(0.210)
6.35
(0.250)
LOCKING
CATCH
15.24
(0.600)
11.43
(0.450)
Part Number
Finish
580100B00000G
Black anodize
580100W00000G
Black anodize with black paint on bottom side
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
0.4
0.8
1.2
1.6
2.0
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
6.35
(0.250)
15.34
(0.604)
REF
19.05
(0.750)
5.39
(0.212)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
100
0
20
40
60
80
100
0
0.4
0.8
1.2
1.6
2.0
80
60
20
40
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Angle fin heat sink is a simple low
cost solution for cooling DIP devices.
Suitable for 14 and 16 pin packages
and available in two finish options.
Easily attaches using thermal epoxy.
5010
Angle fin heat sink
5602, 5802
Slide on heat sink with angled fins
attaches to 14 and 16 pin DIP packages
quickly and easily. The heat sink features
double spring action and locking catch
to firmly attach the device creating a
thermal conduction path on both the
top and bottom surfaces. Available in
two finishes.
15.24
(0.600)
22.61
(0.890)
10.42
(0.410)
LOCKING
CATCH
21.34
(0.840)
5.08
(0.200)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
0.4
0.8
1.2
1.6
2.0
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Device Pkg Style
Finish
“A” Dim
560200B00000G
Ceramic
Black anodize
7.87 (0.310)
560200W00000G
Ceramic
Black anodize with black paint on bottom side
7.87 (0.310)
580200B00000G
Plastic
Black anodize
6.35 (0.250)
580200W00000G
Plastic
Black anodize with black paint on bottom side
6.35 (0.250)
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 0.63 (0.025) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Finish
501000J00000G
Pre black anodize*
501000B00000G
Black anodize
DIPS
* Edges cut during the manufacturing process will be unfinished.
See page 110 for more information.
Grease
Epoxy
&
page112
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PDF描述 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 125701 | 制造商:Brady Corporation 功能描述:B401 10X14 WHT/GRN FULL OXYGEN CYLINDERS |
| 12-5701 | 制造商:GC Electronics 功能描述: |
| 125702 | 制造商:Brady Corporation 功能描述:B302 10X14 WHT/GRN FULL OXYGEN CYLINDERS |
| 12-5702 | 制造商:GC Electronics 功能描述: |
| 1257-02626 | 制造商:Keystone Electronics Corp 功能描述: 制造商:SIMPSON 功能描述: |
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