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参数资料
型号： 125700D00000G
厂商： Aavid Thermalloy
文件页数： 90/116页
文件大小： 0K
描述： SOLDER ANCHOR FOR BGA HEATSINKS
标准包装： 1,000
附件类型： 焊锚（需要 2 个）
适用于相关产品： BGA 散热片
产品目录页面： 2673 (CN2011-ZH PDF)
其它名称： HS400
75
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6.35
(0.250)
10.03
(0.395)
21.08
(0.830)
8.03
(0.316)
"A"
Part Number
“A” Dim
578105B00000G
3.96 (0.156)
578205B00000G
6.35 (0.250)
578305B00000G
12.70 (0.500)
578405B00000G
19.05 (0.750)
578505B00000G
25.40 (1.000)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
50
0
20
40
60
80
100
0.0
0.4
0.8
1.2
1.6
2.0
40
30
10
20
0
400
200
600
800
1000
578205
578105
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Snap on cooler features easy
no tools installation. Folded
back fins provide maximum
surface area while preserving
valuable board space.
5781, 5782, 5783, 5784, 5785
Snap on cooler heat sink
6201, 6202, 6203
Space saving expandable heat sink
features a collar that tightly grips the
device meaning no extra hardware is
required. Heat sinks are constructed of
pre-black anodize material to lower cost.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
50
0
20
40
60
80
100
0.0
0.4
0.8
1.2
1.6
2.0
40
30
10
20
0
400
200
600
800
1000
6202
6201
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
6203
32.51
(1.280)
6.35
(0.250)
8.03
(0.316)
I.D.
"A"
Part Number
“A” Dim
# Fins
6201PBG
6.35 (0.250)
1
6202PBG
12.70 (0.500)
2
6203PBG
19.56 (0.770)
3
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Pre Black Anodize*
TO-05 Heat Sinks
* Edges cut during the manufacturing process will be unfinished.
See page 110 more more information
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
50
0
20
40
60
80
100
0.0
0.4
0.8
1.2
1.6
2.0
40
30
10
20
0
400
200
600
800
1000
578405
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
578305
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
50
0
20
40
60
80
100
0.0
0.4
0.8
1.2
1.6
2.0
40
30
10
20
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
578505
5F
Low cost push on heat sink
12.70
(0.500)
16.00
(0.630)
7.90
(0.311)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
50
0
20
40
60
80
100
0
0.5
1
1.5
2
2.5
40
30
10
20
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Rise
A
bo
ve
Ambien
t—°
C
Part Number
Description
5FG
Low cost push on heat sink
ORDERING INFORMATION
Material: Aluminum
Finish: Black Anodize
Low cost push on heat sink
uses spring pressure to firmly
grip the device case creating
a good thermal interface.
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