参数资料
| 型号： | 4953G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 63/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全数据表： | 4953A THERMALBOND MSDS 4953B THERMALBONDMSDS |
| 标准包装： | 1 |
| 系列： | Thermalbond™ |
| 类型： | 环氧树脂硬化剂 |
| 尺寸/尺寸： | 4 磅包装 |
| 其它名称： | 033871 |
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50
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
10.92
(0.430)
14.22
(0.560)
2.41
(0.095)
7.92
(0.312)
3.18
(0.125)
1.52
(0.060)
12.32
(0.485)
6.15
(0.242)
3.18
(0.125)
9.91
(0.390)
15.88
(0.625)
11.10
(0.437)
18.29
(0.720)
34.93
(1.375)
3.18
(0.125)
12.70
(0.500)
2.36
(0.093)
25.40
(1.000)
3.96
(0.156)
"A"
HIGH DITTIN
0.63
(0.025)
x
SLOT TYP 2
1.78
(0.070)
10.19
(0.401)
x
2.34
(0.092)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
534002
533902
533802
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
5338, 5339, 5340
Extruded heat sink with radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
533802B02554G
25.40 (1.000)
2.67 (0.105)
533902B02554G
38.10 (1.500)
2.67 (0.105)
534002B02554G
50.80 (2.000)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
CLIP 54
19.05
(0.750)
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
41.91
(1.650)
2.36
(0.093)
THRU
3.66
(0.144)
20.96
(0.825)
3.96
(0.156)
"A"
25.40
(1.000)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
04
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
532702
532802
532602
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
5326, 5327, 5328
High power extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
532602B02500G
38.10 (1.500)
2.67 (0.105)
532702B02500G
50.80 (2.000)
2.67 (0.105)
532802B02500G
63.50 (2.500)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
2.00
(0.079)
2.15
(0.085)
15.00
(0.591)
20.00
(0.787)
3.15
(0.124)
THRU
6.00
(0.236)
10.30
(0.406)
25.00
(0.984)
19.50
(0.768)
7.49
(0.295)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
02
4
6
8
10
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow chan-
nel accommodates a TO-220 device.
ML26AA
Extruded channel style heat sink featuring serrated fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
ML26AAG
Extruded channel style heat sink
For additional options see page 83
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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PDF描述 |
|---|---|
| 5-1542000-6 | HEAT SINK BGA 25MM 2FIN RADIAL |
| 5-1542003-0 | 25MM HS ASSY ULTEM CL |
| 5-1542003-1 | 25MM HS ASSY ULTEM CL |
| 5-1542003-9 | 27MM LOW P HS ASSY A- |
| 5-1542004-4 | HEAT SINK BGA 21MM 3FIN RADIAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 4954 | 功能描述:测试点 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安装孔: 电路板厚度: 颜色: |
| 4-954293-1 | 制造商:TE Connectivity 功能描述: |
| 49544-0892 | 制造商:MOLEX 功能描述: |
| 49545-0892 | 功能描述:集管和线壳 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 49-54-5615 | 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT |
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