参数资料
| 型号： | 4953G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 71/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全数据表： | 4953A THERMALBOND MSDS 4953B THERMALBONDMSDS |
| 标准包装： | 1 |
| 系列： | Thermalbond™ |
| 类型： | 环氧树脂硬化剂 |
| 尺寸/尺寸： | 4 磅包装 |
| 其它名称： | 033871 |
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58
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
51310X
51300X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
51330X
51320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
“D” Dim
“E” Dim
513001B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513002B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513101B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513102B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513201B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513202B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
513301B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
17.02 (0.670)
13.72 (0.540)
2.67 (0.105)
513302B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
15.88 (0.625)
11.10 (0.437)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63
Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144)
"A"
34.90
(1.375)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
04
8
12
16
20
8
6
2
4
0
400
200
600
800
1000
BW50
BW63
BW38
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
BW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
BW38-4G
With device mounting hole
38.00 (1.496)
Yes
3.00 (0.118)
BW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
BW50-4G
With device mounting hole
50.00 (1.968)
Yes
3.00 (0.118)
BW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
BW63-4G
With device mounting hole
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相关PDF资料 |
PDF描述 |
|---|---|
| 5-1542000-6 | HEAT SINK BGA 25MM 2FIN RADIAL |
| 5-1542003-0 | 25MM HS ASSY ULTEM CL |
| 5-1542003-1 | 25MM HS ASSY ULTEM CL |
| 5-1542003-9 | 27MM LOW P HS ASSY A- |
| 5-1542004-4 | HEAT SINK BGA 21MM 3FIN RADIAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 4954 | 功能描述:测试点 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安装孔: 电路板厚度: 颜色: |
| 4-954293-1 | 制造商:TE Connectivity 功能描述: |
| 49544-0892 | 制造商:MOLEX 功能描述: |
| 49545-0892 | 功能描述:集管和线壳 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 49-54-5615 | 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT |
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