参数资料
| 型号： | 4953G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 69/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全数据表： | 4953A THERMALBOND MSDS 4953B THERMALBONDMSDS |
| 标准包装： | 1 |
| 系列： | Thermalbond™ |
| 类型： | 环氧树脂硬化剂 |
| 尺寸/尺寸： | 4 磅包装 |
| 其它名称： | 033871 |
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56
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5297, 5298, 5299, 5300
Extruded heat sink with large radial fins
Extruded heat sink with large radial
fins features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
3.18
(0.125)
14.22
(0.560)
13.72
(0.540)
25.40
(1.000)
"C"
"A"
"B"
20.96
(0.825)
41.91
(1.650)
17.02
(0.670)
1.57
(0.062)
3.96
(0.156)
25.40
(1.000)
2.36
(0.093)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
52980X
52970X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
529701B02500G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529702B02500G
TO-220
25.40 (1.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529801B02500G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529802B02500G
TO-220
38.10 (1.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
529901B02500G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
529902B02500G
TO-220
50.80 (2.000)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
530001B02500G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
3.66 (0.144)
2.67 (0.105)
530002B02500G
TO-220
63.50 (2.500)
18.29 (0.720)
3.17 (0.125)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
53000X
52990X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
For additional options see page 83
TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63
Extruded heat sink with unequal channel widths
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
25.00
(0.984) 19.90
(0.783)
15.00
(0.591)
4.00
(0.157)
2.50
(0.098)
25.40
(1.000)
3.20
(0.126)
"A"
SEE NOTE 1
TYP
34.50
(1.358)
12.50
(0.492)
6.25
(0.246)
2.00
(0.079)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW38
SW25
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
“A” Dim
Holes
SW25-2G
Extruded heat sink with unequal channel widths front and back
25.00 (0.984)
No
3.00 (0.118)
SW25-4G
With device mounting holes
25.00 (0.984)
Yes
3.00 (0.118)
SW38-2G
Extruded heat sink with unequal channel widths front and back
38.00 (1.496)
No
3.00 (0.118)
SW38-4G
With device mounting holes
38.00 (1.496)
Yes
3.00 (0.118)
SW50-2G
Extruded heat sink with unequal channel widths front and back
50.00 (1.968)
No
3.00 (0.118)
SW50-4G
With device mounting holes
50.00 (1.968)
Yes
3.00 (0.118)
SW63-2G
Extruded heat sink with unequal channel widths front and back
63.00 (2.480)
No
3.00 (0.118)
SW63-4G
With device mounting holes
63.00 (2.480)
Yes
3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
SW63
SW50
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
NOTE 1: This hole not present in SW25 model
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 4954 | 功能描述:测试点 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安装孔: 电路板厚度: 颜色: |
| 4-954293-1 | 制造商:TE Connectivity 功能描述: |
| 49544-0892 | 制造商:MOLEX 功能描述: |
| 49545-0892 | 功能描述:集管和线壳 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
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