参数资料
| 型号： | 4953G |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 67/116页 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全数据表： | 4953A THERMALBOND MSDS 4953B THERMALBONDMSDS |
| 标准包装： | 1 |
| 系列： | Thermalbond™ |
| 类型： | 环氧树脂硬化剂 |
| 尺寸/尺寸： | 4 磅包装 |
| 其它名称： | 033871 |
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54
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
ORDERING INFORMATION
5301
High rise style heat sink features twisted fins and Wave-On
TM solderable mounts
High rise style heat sink features
twisted fins and Wave-On
TM solder-
able mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a con-
venient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
Part Number
Description
Device
Figure
“A” Dim
530101B00100G Heat sink twisted fin
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
530101B00150G With device clip #50
TO-218, TO-247
A
21.08 (0.830)
4.75 (0.187)
530102B00100G Heat sink twisted fin
TO-220
18.29 (0.720)
4.75 (0.187)
530102B00150G With device clip #50
TO-220
A
18.29 (0.720)
4.75 (0.187)
530161B00162G With two device clips #62
Dual TO-218, TO-247
B
21.08 (0.830)
4.75 (0.187)
530162B00162G With two device clips #62
Dual TO-220
B
18.29 (0.720)
4.75 (0.187)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
530161 or 530162
530101 or 530102
5308
High rise style heat sink features twisted fins and solderable tabs
High rise style heat sink features
twisted fins and solderable tabs
for easy attachment to the PC card.
Models include thru holes on one
side to attach devices using stan-
dard hardware and dittins with
special slots on the other for easy
device attachment using a conven-
ient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
RECOMMENDED
HOLE PATTERN
43.13
(1.698)
2.95
(0.116)
THRU 2x
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
"A"
3.00
(0.118)
22.90
(0.900)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.62
(0.300)
10.16
(0.400)
45.72
(1.800)
46.74
(1.841)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Rise
A
bo
ve
Ambien
t—°C
530861 or 530862
530801 or 530802
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
Device
Figure
“A” Dim
530801B05100G
Heat sink twisted fin and solderable tabs
TO-218, TO-247
21.08 (0.830)
2.95 (0.116)
530801B05150G
With device clip #50
TO-218, TO-247
A
21.08 (0.830)
2.95 (0.116)
530802B05100G
Heat sink twisted fin and solderable tabs
TO-220
18.29 (0.720)
2.95 (0.116)
530802B05150G
With device clip #50
TO-220
A
18.29 (0.720)
2.95 (0.116)
530861B05162G
With two device clips #62
Dual TO-218, TO-247
B
21.08 (0.830)
2.95 (0.116)
530862B05162G
With two device clips #62
Dual TO-220
B
18.29 (0.720)
2.95 (0.116)
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2.79
(0.110)
0.76
(0.030)
x
HIGH
DITTIN
12.45
(0.490)
2.54
(0.100)
1.57
(0.062)
2X
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
x
HIGH
DITTIN
12.45
(0.490)
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
2.79
(0.110)
0.76
(0.030)
X
HIGH
DITTIN
12.45
(0.490)
2X
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
FIGURE A
FIGURE B
FIGURE A
FIGURE B
CLIP 50
CLIP 62
BASE PART
44.45
(1.750)
2.54
(0.100)
3.20
(0.126)
THRU
"A"
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
7.50
(0.295)
7.62
(0.300)
24.13
(0.950)
44.45
(1.750)
10.16
(0.400)
BASE PART
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 4954 | 功能描述:测试点 LOOP TEST POINT .020 RoHS:否 制造商:Keystone Electronics 安装孔: 电路板厚度: 颜色: |
| 4-954293-1 | 制造商:TE Connectivity 功能描述: |
| 49544-0892 | 制造商:MOLEX 功能描述: |
| 49545-0892 | 功能描述:集管和线壳 NEW MINIFIT Pin HSG in HSG Upper TPA-8P RoHS:否 产品种类:1.0MM Rectangular Connectors 产品类型:Headers - Pin Strip 系列:DF50 触点类型:Pin (Male) 节距:1 mm 位置/触点数量:16 排数:1 安装风格:SMD/SMT 安装角:Right 端接类型:Solder 外壳材料:Liquid Crystal Polymer (LCP) 触点材料:Brass 触点电镀:Gold 制造商:Hirose Connector |
| 49-54-5615 | 制造商:MILWAUKEE TOOL 功能描述:DUST COLLECTION PORT |
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