参数资料
| 型号： | 7140DG |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 13/116页 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 产品培训模块： | How to Select a Heat Sink |
| 标准包装： | 1,000 |
| 类型： | 插件板级 |
| 冷却式包装： | TO-220 |
| 固定方法： | 夹和 PC 引脚 |
| 形状： | 矩形 |
| 长度： | 0.700"（17.78mm） |
| 宽： | 0.90"（22.86mm） |
| 机座外的高度（散热片高度）： | 0.375"（9.52mm） |
| 温升时的功耗： | 1.5W @ 50°C |
| 在强制气流下的热敏电阻： | 在 200 LFM 时为10.0°C/W |
| 自然环境下的热电阻： | 20.8°C/W |
| 材质： | 铜 |
| 材料表面处理： | 锡 |
| 其它名称： | 043239 |
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11
READING
A
T
HERMAL
PERFORMANCE
GR
APH
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The performance graphs you will see in this
catalog (see graph 579802) are actually a
composite of two separate graphs which
have been combined to save space. The small
arrows on each curve indicate to which axis
the curve corresponds. Thermal graphs are
published assuming the device to be cooled
is properly mounted and the heat sink is in
its recommended mounting position.
GRAPH A is used to show heat sink perform-
ance when used in a natural convection envi-
ronment (i.e. without forced air). This graph
starts in the lower left hand corner with the
horizontal axis representing the heat dissipa-
tion (watts) and the vertical left hand axis
representing the rise in heat sink mounting
surface temperature above ambient (°C). By
knowing the power to be dissipated, the
temperature rise of the mounting surface
can be predicted. Thermal resistance in natu-
ral convection is determined by dividing this
temperature rise by the power input (°C/W).
EXAMPLE A: Aavid Thermalloy part number
579802 is to be used to dissipate 3 watts of
power in natural convection. Because we are
dealing with natural convection, we refer to
graph “A”. Knowing that 3 watts are to be dis-
sipated, follow the grid line to the curve and
find that at 3 watts there is a temperature
rise of 75°C. To get the thermal resistance,
divide the temperature rise by the power
dissipated, which yields 25°C/W.
GRAPH B is used to show heat sink per-
formance when used in a forced convec-
tion environment (i.e. with forced air flow
through the heat sink). This graph has its
origin in the top right hand corner with
the horizontal axis representing air velocity
over the heat sink LFM* and the vertical
axis representing the thermal resistance of
the heat sink (°C/W). Air velocity is calculat-
ed by dividing the output volumetric flow
rate of the fan by the cross-sectional area
of the outflow air passage.
EXAMPLE B: For the same application
we add a fan which blows air over the heat
sink at a velocity of 400 LFM.
The addition of a fan indicates the use of
forced convection and therefore we refer
to graph “B”. This resistance of 9.50°C/W is
then multiplied by the power to be dissi-
pated, 3 watts. This yields a temperature
rise of 28.5°C.
CONVERTING VOLUME
TO VELOCITY
Although most fans are normally rated and
compared at their free air delivery at zero
back pressure, this is rarely the case in most
applications. For accuracy, the volume of
output must be derated 60%–80% for
the anticipation of back pressure.
EXAMPLE: The output air volume
of a fan is given as 80 CFM. The output area
is 6 inches by 6 inches or 36 in2 or 25 ft2.
To find velocity:
80
0.25
Velocity is 320 LFM, which at 80%,
derates to 256 LFM.
DESIGN ASSISTANCE
Aavid Thermalloy can assist in the design
of heat sinks for both forced and natural
convection applications. Contact us for help
with your next thermal challenge. For more
information, visit our web site at:
www.aavidthermalloy.com
Heat Dissipated—Watts
0
20
40
60
80
100
01
2
3
4
5
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Air Velocity—Feet Per Minute
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
16
12
4
8
0
400
200
600
800
1000
GRAPH B
Velocity (LFM) =
Velocity =
= 320
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
GRAPH A
579802
Reading a Thermal Performance Graph
Velocity
(LFM)* = Volume (CFM)**
area (ft2)
* Linear feet per minute
** Cubic feet per minute
Volume (CFM)
area (ft2)
相关PDF资料 |
PDF描述 |
|---|---|
| SOMC160351R0GEA | RES ARRAY 51 OHM 8 RES 16-SOIC |
| 1-767096-0 | CONN RCPT 114POS .025 VERT SMD |
| 309157970000035 | COVER SCREW FOR 9157 SERIES 3.5M |
| 767116-2 | CONN PLUG 76POS .025 VERT SMD |
| 6225B-MTG | BOARD LEVEL HEAT SINK |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 7140E | 制造商:Excelta Corporation 功能描述:ROUND CUTTER SEMI FLUSH 0.042IN 5.75IN 制造商:Excelta Corporation 功能描述:ROUND CUTTER, SEMI FLUSH, 0.042IN 5.75IN; Overall Length:5.75"; Cutter Type:Round Head; Cut Type:Semi Flush; Cutting Capacity Max:0.042" ;RoHS Compliant: NA |
| 7140LA100C | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 8K-Bit 1K x 8 100ns 48-Pin SBCDIP 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 8KBIT 1KX8 100NS 48PIN SBDIP - Bulk |
| 7140LA100CB | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 8K-Bit 1K x 8 100ns 48-Pin SBCDIP Tube 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 8KBIT 1KX8 100NS 48PIN SBDIP - Bulk |
| 7140LA100J | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| 7140LA100J8 | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
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