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参数资料
型号： 7140DG
厂商： Aavid Thermalloy
文件页数： 57/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 1,000
类型： 插件板级
冷却式包装： TO-220
固定方法： 夹和 PC 引脚
形状： 矩形
长度： 0.700"（17.78mm）
宽： 0.90"（22.86mm）
机座外的高度（散热片高度）： 0.375"（9.52mm）
温升时的功耗： 1.5W @ 50°C
在强制气流下的热敏电阻： 在 200 LFM 时为10.0°C/W
自然环境下的热电阻： 20.8°C/W
材质： 铜
材料表面处理： 锡
其它名称： 043239
45
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5744, 5745, 5746, 5749
Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on
heat sink features spring action
to firmly hold the device tab to the
heat sink providing maximum metal
to metal contact and good thermal
conduction. Available with solder-
able tabs for horizontal or vertical
mounting to the PC board.
9.52
(0.375)
21.08
(0.830)
HOLDING TABS
DITTIN
11.81
(0.465)
10.03
(0.395)
21.84
(0.860)
14.99
(0.590)
"A"
3.18
(0.125)
9.02
(0.355)
3.81
(0.150)
1.57
(0.062)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
574402
574502
5741
Low cost, labor saving, slide on heat sink featuring spring action
Low cost, labor saving, slide on heat sink
features spring action to firmly hold the device
tab to the heat sink providing maximum metal
to metal contact and good thermal conduction.
Includes a clearance hole in the top side to allow
the use of optional hardware to attach device
and heat sink to circuit board or other surface.
Also available with solderable tabs for vertical
mounting to the PC board.
21.84
(0.860)
9.02
(0.355)
19.05
(0.750)
3.81
(0.150)
10.03
(0.395)
11.81
(0.465)
14.99
(0.590)
20.57
(0.810)
7.62
(0.300)
CLEARANCE
DITTIN
9.52
(0.375)
5.33
(0.210)
1.57
(0.062)
THRU
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
574102B00000G
Low cost slide on heat sink, no solderable tabs
574102B03300G
With solderable tabs
1.91 (0.075)
ORDERING INFORMATION
10.03
(0.400)
1.57
(0.062)
5.33
(0.210)
9.52
(0.375)
9.02
(0.355)
HOLDING TABS
20.57
(0.810)
21.84
(0.860)
"A"
4.19
(0.165)
11.81
(0.465)
14.99
(0.590)
DITTIN
TAB
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
TO-220 Heat Sinks
Part Number
Description
Figure
“A” Dim
574402B00000G
Low cost slide on heat sink, no solderable tabs
A
19.05 (0.750)
574402B03200G
With solderable tabs for horizontal mounting
A
19.05 (0.750)
1.91 (0.075)
574502B00000G
Low cost slide on heat sink, no solderable tabs
B
19.05 (0.750)
574502B03300G
With solderable tabs for vertical mounting
B
19.05 (0.750)
1.91 (0.075)
574602B00000G
Low cost slide on heat sink , no solderable tabs
B
17.53 (0.690)
574602B03300G
With solderable tabs for vertical mounting
B
17.53 (0.690)
1.91 (0.075)
574902B00000G
Low cost slide on heat sink , no solderable tabs
B
35.05 (1.380)
574902B03300G
With solderable tabs for vertical mounting
B
35.05 (1.380)
1.91 (0.075)
Position
Code
Description
Details
A
37
Solderable tab with step to limit insertion depth
Page 92
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
574902
574602
POPULAR OPTIONS:
Base part no.
A
574102B0 00 00G
For additional options see page 82
FIGURE A
FIGURE B
For additional options see page 82
Mounting
Kits
page 99
相关PDF资料
PDF描述
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6225B-MTG BOARD LEVEL HEAT SINK
相关代理商/技术参数
参数描述
7140E 制造商:Excelta Corporation 功能描述:ROUND CUTTER SEMI FLUSH 0.042IN 5.75IN 制造商:Excelta Corporation 功能描述:ROUND CUTTER, SEMI FLUSH, 0.042IN 5.75IN; Overall Length:5.75"; Cutter Type:Round Head; Cut Type:Semi Flush; Cutting Capacity Max:0.042" ;RoHS Compliant: NA
7140LA100C 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 8K-Bit 1K x 8 100ns 48-Pin SBCDIP 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 8KBIT 1KX8 100NS 48PIN SBDIP - Bulk
7140LA100CB 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 8K-Bit 1K x 8 100ns 48-Pin SBCDIP Tube 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 8KBIT 1KX8 100NS 48PIN SBDIP - Bulk
7140LA100J 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray
7140LA100J8 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray
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