参数资料
型号: 7140DG
厂商: Aavid Thermalloy
文件页数: 63/116页
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
产品培训模块: How to Select a Heat Sink
标准包装: 1,000
类型: 插件板级
冷却式包装: TO-220
固定方法: 夹和 PC 引脚
形状: 矩形
长度: 0.700"(17.78mm)
宽: 0.90"(22.86mm)
机座外的高度(散热片高度): 0.375"(9.52mm)
温升时的功耗: 1.5W @ 50°C
在强制气流下的热敏电阻: 在 200 LFM 时为10.0°C/W
自然环境下的热电阻: 20.8°C/W
材质:
材料表面处理:
其它名称: 043239
50
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
10.92
(0.430)
14.22
(0.560)
2.41
(0.095)
7.92
(0.312)
3.18
(0.125)
1.52
(0.060)
12.32
(0.485)
6.15
(0.242)
3.18
(0.125)
9.91
(0.390)
15.88
(0.625)
11.10
(0.437)
18.29
(0.720)
34.93
(1.375)
3.18
(0.125)
12.70
(0.500)
2.36
(0.093)
25.40
(1.000)
3.96
(0.156)
"A"
HIGH DITTIN
0.63
(0.025)
x
SLOT TYP 2
1.78
(0.070)
10.19
(0.401)
x
2.34
(0.092)
2x
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
534002
533902
533802
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Extruded heat sink with radial fins
and channel clip attach feature
make device attachment easy.
Includes clip and two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in three
heights for TO-220 devices.
5338, 5339, 5340
Extruded heat sink with radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
533802B02554G
25.40 (1.000)
2.67 (0.105)
533902B02554G
38.10 (1.500)
2.67 (0.105)
534002B02554G
50.80 (2.000)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
CLIP 54
19.05
(0.750)
25.40
(1.000)
2.54
(0.100)
11.68
(0.460)
41.91
(1.650)
2.36
(0.093)
THRU
3.66
(0.144)
20.96
(0.825)
3.96
(0.156)
"A"
25.40
(1.000)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
5
0
20
40
60
80
100
04
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
532702
532802
532602
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
High power extruded heat sink
with large radial fins and
increased fin count for additional
cooling capacity. Solderable pins
allow vertical mounting without
stress on the device leads. Available
in three heights for TO-220 devices.
5326, 5327, 5328
High power extruded heat sink with large radial fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
“A” Dim
532602B02500G
38.10 (1.500)
2.67 (0.105)
532702B02500G
50.80 (2.000)
2.67 (0.105)
532802B02500G
63.50 (2.500)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
2.00
(0.079)
2.15
(0.085)
15.00
(0.591)
20.00
(0.787)
3.15
(0.124)
THRU
6.00
(0.236)
10.30
(0.406)
25.00
(0.984)
19.50
(0.768)
7.49
(0.295)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
02
4
6
8
10
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Extruded channel style heat sink
features serrated fins for increased
cooling capacity. The base of the heat
sink is notched to clear the device
leads when mounted horizontally on
the printed circuit card. Narrow chan-
nel accommodates a TO-220 device.
ML26AA
Extruded channel style heat sink featuring serrated fins
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Description
ML26AAG
Extruded channel style heat sink
For additional options see page 83
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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6225B-MTG BOARD LEVEL HEAT SINK
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