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参数资料
型号： 7140DG
厂商： Aavid Thermalloy
文件页数： 83/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 1,000
类型： 插件板级
冷却式包装： TO-220
固定方法： 夹和 PC 引脚
形状： 矩形
长度： 0.700"（17.78mm）
宽： 0.90"（22.86mm）
机座外的高度（散热片高度）： 0.375"（9.52mm）
温升时的功耗： 1.5W @ 50°C
在强制气流下的热敏电阻： 在 200 LFM 时为10.0°C/W
自然环境下的热电阻： 20.8°C/W
材质： 铜
材料表面处理： 锡
其它名称： 043239
69
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5203
Two piece heat sink
Two piece heat sink adds
extra cooling in the same
amount of board space as
other solutions. Base and
top can be ordered separately.
(1.250)
31.75
(0.500)
12.70
(1.530)
38.86
(1.187)
30.15
2x
(0.218)
5.54
2x
THRU
(0.188)
4.78
THRU
16.89
(0.665)
4.34
(0.171)
5.46
(0.215)
10.92
(0.430)
Part Number
Description
Figure
520327B00000G
Two piece heat sink assembly, base and top
520328B00000G
Top only
B
520329B00000G
Base only
A
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
ro
m
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
520328
520329
520327
Moun
ting
Sur
fac
eT
emp
Rise
A
bo
ve
Ambien
t—°C
ORDERING INFORMATION
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Finish
579103B00000G
Black anodize
579103V00000G
AavSHIELD3
SLOT
30.15
(1.187)
REF
4.83
(0.190)
4.06
(0.160)
x
39.12
(1.540)
22.10
(0.870)
9.91
(0.390)
28.57
(1.125)
Space saving expandable collar heat sink
has the same footprint as the device being
cooled meaning no extra board space is
required to fit the heat sink. The expandable
collar tightly grips the device meaning no
extra hardware is required. May also be used
with any diamond or square basket heat sink
to form a two piece heat sink for additional
cooling. Available in conductive AavSHIELD3
or black anodize finish.
5791
Space saving expandable collar heat sink
5060
Low profile hat section heat sink
is ideal for applications where low
component heights are required
such as card cages with PCBs
mounted on 0.500 centers.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
04
8
12
16
20
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
506003B00000G
Low profile hat section heat sink
ORDERING INFORMATION
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
(2.000)
50.80
(1.200)
30.48
(1.750)
44.45
(0.375)
9.52
2x
THRU
(0.188)
4.78
(1.187)
30.15
(0.072)
1.82
(0.593)
15.06
(0.430)
10.92
(0.215)
5.46
2x
THRU
(0.218)
5.54
CL1
CL2
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
TO-3 Heat Sinks
For additional options see page 84
FIGURE A
FIGURE B
21.34
(0.840)
2.81
(0.110)
38.95
(1.534)
THRU TYP 2
3.71
(0.146)
14.17
(0.558)
THRU TYP 2
4.06
(0.160)
30.65
(1.206)
7.87
(0.310)
9.27
(0.365)
For additional options see page 84
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Mounting
Kits
page 99
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6225B-MTG BOARD LEVEL HEAT SINK
相关代理商/技术参数
参数描述
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7140LA100J8 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray
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