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参数资料
| 型号： | 73S8023C-IMR/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 20/27页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD INTERFACE 32-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 控制器类型： | 智能卡接口 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 电流 - 电源： | 4.9mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（5x5） |
| 包装： | 带卷 (TR) |
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DS_8023C_019
73S8023C Data Sheet
Rev. 1.5
27
Revision History
Revision
Date
Description
1.0
6/13/2005
First publication.
1.1
7/15/2005
Converted to Teridian format.
1.2
12/5/2007
Add EMV and ISO logo, remove leaded package option, change 32QFN
punched to SAWN package.
1.3
1/17/2008
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
1.4
1/8/2009
Added NDS logo to page 1 and assigned document number.
1.5
4/3/2009
Removed all references to VPC as VPC must be tied to VDD.
2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.Teridian.com
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| 78P2351R-IMR/F | IC LIU NRZ-CMI CONV 155M 56-QFN |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8024C-DB | 功能描述:界面开发工具 73S8024C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8024C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8024C-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Low Cost Smart Card Interface |
| 73S8024RN-20IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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