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| 型号： | 73S8023C-IMR/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/27页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD INTERFACE 32-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 控制器类型： | 智能卡接口 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 电流 - 电源： | 4.9mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（5x5） |
| 包装： | 带卷 (TR) |
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DS_8023C_019
73S8023C Data Sheet
Rev. 1.5
11
8
Activation and Deactivation
8.1
Activation Sequence (Synchronous Mode)
The 73S8023C smart card interface IC has an internal ~10 ms delay at power-on reset or on application
of VDD > VDDF
1.
CMDVCC is set low.
. No activation is allowed at this time.
CMDVCC (edge triggered) must then be set low to
activate the card.
The following steps list the activation sequence and the timing of the card control signals when the
system controller sets
CMDVCC low:
2.
Turn on VCC and I/O (AUX1, AUX2) to reception mode at the end of (tACT
3.
RST is a copy of
RSTIN and CLK is a copy of STROBE after (t
).
1).
Figure 3: Activation Sequence – Synchronous Mode
8.2
Deactivation Sequence (Synchronous Mode)
Deactivation is initiated either by the system controller by setting the
CMDVCC high, or automatically in
the event of hardware faults. Hardware faults are over-current, overheating, VDD
1.
RST goes low at time t
fault and card extraction
during the session and are indicated to the system controller by the fall of
OFF.
The following steps list the deactivation sequence and the timing of the card control signals when the
system controller sets the
CMDVCC high or a fault condition sets OFF low:
1
2.
CLK stops low at time t
.
2
3.
I/O goes low at time t
.
3
4.
V
. Out of reception mode.
CC is shut down at time t 4. After a delay t 5 (discharge of the V CC capacitor), VCC is low.
CMDVCC
VCC
IO
CLK
RSTIN
tACT
t1
RST
STROBE
tACT ~= 500s
t1 > 0.5s after tACT, RST = RSTIN, CLK = STROBE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8024C-DB | 功能描述:界面开发工具 73S8024C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8024C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8024C-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Low Cost Smart Card Interface |
| 73S8024RN-20IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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