参数资料
型号: A3P1000-2FGG144II
元件分类: FPGA
英文描述: FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144
封装: 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
文件页数: 23/49页
文件大小: 5893K
代理商: A3P1000-2FGG144II
ProASIC3 DC and Switching Characteristics
2- 76
v1.3
Timing Characteristics
VersaTile Specifications as a Sequential Module
The ProASIC3 library offers a wide variety of sequential cells, including flip-flops and latches. Each
has a data input and optional enable, clear, or preset. In this section, timing characteristics are
presented for a representative sample from the library. For more details, refer to the Fusion,
Table 2-96 Combinatorial Cell Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Combinatorial Cell
Equation
Parameter
–2
–1
Std.
–F
Units
INV
Y = !A
tPD
0.40
0.46
0.54
0.65
ns
AND2
Y = A B
tPD
0.47
0.54
0.63
0.76
ns
NAND2
Y = !(A B)
tPD
0.47
0.54
0.63
0.76
ns
OR2
Y = A + B
tPD
0.49
0.55
0.65
0.78
ns
NOR2
Y = !(A + B)
tPD
0.49
0.55
0.65
0.78
ns
XOR2
Y = A
Bt
PD
0.74
0.84
0.99
1.19
ns
MAJ3
Y = MAJ(A, B, C)
tPD
0.70
0.79
0.93
1.12
ns
XOR3
Y = A
B Ct
PD
0.87
1.00
1.17
1.41
ns
MUX2
Y = A !S + B S
tPD
0.51
0.58
0.68
0.81
ns
AND3
Y = A B C
tPD
0.56
0.64
0.75
0.90
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
Figure 2-25 Sample of Sequential Cells
DQ
DFN1
Data
CLK
Out
D
Q
DFN1C1
Data
CLK
Out
CLR
DQ
DFI1E1P1
Data
CLK
Out
En
PRE
D
Q
DFN1E1
Data
CLK
Out
En
相关PDF资料
PDF描述
A3P1000-2FGG256II FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA256
A3P1000-2FGG484II FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484
A3P1000-2PQ208II FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208
A3P1000-2PQG208II FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208
A3P1000-FG144II FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144
相关代理商/技术参数
参数描述
A3P1000-2FGG144PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P1000-2FGG256 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A3P1000-2FGG256I 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A3P1000-2FGG256X212 制造商:Microsemi Corporation 功能描述:
A3P1000-2FGG484 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)