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参数资料
| 型号： | A3P1000-2FGG144II |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144 |
| 封装： | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 |
| 文件页数： | 28/49页 |
| 文件大小： | 5893K |
| 代理商： | A3P1000-2FGG144II |
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ProASIC3 DC and Switching Characteristics
v1.3
2 - 107
Advance v0.5
(continued)
The "I/O Banks" section is new. This section explains the following types of I/Os:
Advanced
Standard+
Standard
Table 2-12 Automotive ProASIC3 Bank Types Definition and Differences is
new. This table describes the standards listed above.
2-29
PCI-X 3.3 V was added to the Compatible Standards for 3.3 V in Table 2-
11 VCCI Voltages and Compatible Standards
2-29
Table 2-13 ProASIC3 I/O Features was updated.
2-30
The "Double Data Rate (DDR) Support" section was updated to include
information concerning implementation of the feature.
2-32
The "Electrostatic Discharge (ESD) Protection" section was updated to include
testing information.
2-35
Level 3 and 4 descriptions were updated in Table 2-43 I/O Hot-Swap and 5 V
Input Tolerance Capabilities in ProASIC3 Devices.
2-64
The notes in Table 2-43 I/O Hot-Swap and 5 V Input Tolerance Capabilities in
ProASIC3 Devices were updated.
2-64
The "Simultaneous Switching Outputs (SSOs) and Printed Circuit Board Layout"
section is new.
2-41
A footnote was added to Table 2-14 Maximum I/O Frequency for Single-Ended
and Differential I/Os in All Banks in Automotive ProASIC3 Devices (maximum
drive strength and high slew selected).
2-30
Table 2-18 Automotive ProASIC3 I/O Attributes vs. I/O Standard Applications
2-45
Table 2-50 ProASIC3 Output Drive (OUT_DRIVE) for Standard I/O Bank Type
(A3P030 device)
2-83
Table 2-51 ProASIC3 Output Drive for Standard+ I/O Bank Type was updated.
2-84
Table 2-54 ProASIC3 Output Drive for Advanced I/O Bank Type was updated.
2-84
The "x" was updated in the "User I/O Naming Convention" section.
2-48
The "VCC Core Supply Voltage" pin description was updated.
2-50
The "VMVx I/O Supply Voltage (quiet)" pin description was updated to include
information concerning leaving the pin unconnected.
2-50
The "VJTAG JTAG Supply Voltage" pin description was updated.
2-50
The "VPUMP Programming Supply Voltage" pin description was updated to
include information on what happens when the pin is tied to ground.
2-50
The "I/O User Input/Output" pin description was updated to include information
on what happens when the pin is unused.
2-50
The "JTAG Pins" section was updated to include information on what happens
when the pin is unused.
2-51
The "Programming" section was updated to include information concerning
serialization.
2-53
The
"JTAG
1532"
section
was
updated
to
include
SAMPLE/PRELOAD
information.
2-54
"DC and Switching Characteristics" chapter was updated with new information.
3-1
Previous Version
Changes in Current Version (v1.3)
Page
相关PDF资料 |
PDF描述 |
|---|---|
| A3P1000-2FGG256II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA256 |
| A3P1000-2FGG484II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA484 |
| A3P1000-2PQ208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
| A3P1000-2PQG208II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PQFP208 |
| A3P1000-FG144II | FPGA, 24576 CLBS, 1000000 GATES, 350 MHz, PBGA144 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P1000-2FGG144PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P1000-2FGG256 | 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P1000-2FGG256I | 功能描述:IC FPGA 1KB FLASH 1M 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A3P1000-2FGG256X212 | 制造商:Microsemi Corporation 功能描述: |
| A3P1000-2FGG484 | 功能描述:IC FPGA 1KB FLASH 1M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
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