参数资料
| 型号： | A3PN010-QNG48 |
| 厂商： | Microsemi SoC |
| 文件页数： | 14/114页 |
| 文件大小： | 0K |
| 描述： | IC FPGA NANO 10K GATES 48-QFN |
| 标准包装： | 260 |
| 系列： | ProASIC3 nano |
| 输入/输出数： | 34 |
| 门数： | 10000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 48-VFQFN 裸露焊盘 |
| 供应商设备封装： | 48-QFN（6x6） |
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Datasheet Information
5-4
Revision 11
Revision
Changes
Page
Revision 7 (Jan 2010)
Product Brief Advance
v0.7
All product tables and pin tables were updated to show clearly that A3PN030 is
available only in the Z feature at this time, as A3PN030Z. The nano-Z feature
grade devices are designated with a Z at the end of the part number.
N/A
Packaging Advance
v0.6
The "68-Pin QFN" and "100-Pin VQFP" pin tables for A3PN030 were removed.
Only the Z grade for A3PN030 is available at this time.
N/A
Revision 6 (Aug 2009)
Product Brief Advance
v0.6
Packaging
Advance
v0.5
The note for A3PN030 in the "ProASIC3 nano Devices" table was revised. It
states A3PN030 is available in the Z feature grade only.
The "68-Pin QFN" pin table for A3PN030 is new.
3-7
are new.
The "100-Pin VQFP" pin table for A3PN060Z is new.
The "100-Pin VQFP" pin table for A3PN125Z is new
The "100-Pin VQFP" pin table for A3PN250Z is new.
Revision 5 (Mar 2009)
Product Brief Advance
v0.5
All references to speed grade –F were removed from this document.
N/A
The"I/Os with Advanced I/O Standards" section was revised to add definitions of
hot-swap and cold-sparing.
Revision 4 (Feb 2009)
Packaging Advance
v0.4
The "100-Pin VQFP" pin table for A3PN030 is new.
3-10
Revision 3 (Feb 2009)
Packaging Advance
v0.3
The "100-Pin QFN" section was removed.
N/A
Revision 2 (Nov 2008)
Product Brief Advance
v0.4
The "ProASIC3 nano Devices" table was revised to change the maximum user
I/Os for A3PN020 and A3PN030. The following table note was removed: "Six chip
(main) and three quadrant global networks are available for A3PN060 and
above."
The QN100 package was removed for all devices.
N/A
The "Device Marking" section is new.
Revision 1 (Oct 2008)
Product Brief Advance
v0.3
The A3PN030 device was added to product tables and replaces A3P030 entries
that were formerly in the tables.
The "Wide Range I/O Support" section is new.
The "I/Os Per Package" table was updated to add the following information to
table note 4: "For nano devices, the VQ100 package is offered in both leaded and
RoHS-compliant versions. All other packages are RoHS-compliant only."
updated to remove QN100 for A3PN250.
The "General Description" section was updated to give correct information about
number of gates and dual-port RAM for ProASIC3 nano devices.
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| EEC40DTEI | CONN EDGECARD 80POS .100 EYELET |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3PN010-QNG48I | 功能描述:IC FPGA NANO 10K GATES 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN015-1QNG68 | 功能描述:IC FPGA NANO 15K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN015-1QNG68I | 功能描述:IC FPGA NANO 15K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN015-2QNG68 | 功能描述:IC FPGA NANO 15K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN015-2QNG68I | 功能描述:IC FPGA NANO 15K GATES 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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