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参数资料
| 型号： | AD9222ABCPZRL7-65 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 33/60页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT SRL 65MSPS 64LFCSP |
| 标准包装： | 750 |
| 位数： | 12 |
| 采样率（每秒）： | 65M |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 8 |
| 功率耗散（最大）： | 950.5mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 64-LFCSP-VQ（9x9） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 16 个单端，单极；8 个差分，单极 |
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Data Sheet
AD9222
Rev. F | Page 39 of 60
Power and Ground Recommendations
When connecting power to the AD9222, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one supply is available, it
should be routed to the AVDD first and then tapped off and
isolated with a ferrite bead or a filter choke preceded by
decoupling capacitors for the DRVDD. The user can employ
several different decoupling capacitors to cover both high and
low frequencies. These should be located close to the point of
entry at the PC board level and close to the parts, with minimal
trace lengths.
A single PC board ground plane should be sufficient when
using the AD9222. With proper decoupling and smart parti-
tioning of the PC board’s analog, digital, and clock sections,
optimum performance can be easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9222. An
exposed continuous copper plane on the PCB should mate to
the AD9222 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder-filled or plugged.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
several tie points between the ADC and PCB during the reflow
process, whereas using one continuous plane with no partitions
only guarantees one tie point. See Figure 85 for a PCB layout
example. For detailed information on packaging and the PCB
layout of chip scale packages, see the AN-772 Application Note,
A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
SILKSCREEN PARTITION
PIN 1 INDICATOR
05967-
069
Figure 85. Typical PCB Layout
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD9222BCPZ-40 | 制造商:Analog Devices 功能描述:Octal ADC Pipelined 40Msps 12-bit Serial 64-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述: |
| AD9222BCPZ-50 | 制造商:Analog Devices 功能描述:ADC Octal Pipelined 50Msps 12-bit Serial 64-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Analog Devices 功能描述:12BIT ADC OCTAL 50MSPS LFCSP-64 |
| AD9222BCPZ-65 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| AD9222BCPZRL7-40 | 制造商:AD 制造商全称:Analog Devices 功能描述:Octal, 12-Bit, 40/50 MSPS Serial LVDS 1.8 V A/D Converter |
| AD9222BCPZRL7-50 | 制造商:Analog Devices 功能描述:ADC Octal Pipelined 50Msps 12-bit Serial 64-Pin LFCSP EP T/R |
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