参数资料
型号: AD9608BCPZ-105
厂商: Analog Devices Inc
文件页数: 2/40页
文件大小: 0K
描述: IC ADC DUAL 10BIT 64-LFCSP
标准包装: 1
位数: 10
采样率(每秒): 105M
数据接口: LVDS,并联,串行,SPI
转换器数目: 2
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 托盘
输入数目和类型: 4 个单端,2 个差分
AD9608
Rev. 0 | Page 10 of 40
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VCM to AGND
0.3 V to AVDD + 0.2 V
RBIAS to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND
0.3 V to DRVDD + 0.2 V
SDIO/DCS to AGND
0.3 V to DRVDD + 0.2 V
OEB
0.3 V to DRVDD + 0.2 V
PDWN
0.3 V to DRVDD + 0.2 V
D0A, D0B through D9A, D9B to AGND
0.3 V to DRVDD + 0.2 V
DCOA
, DCOB to AGND
0.3 V to DRVDD + 0.2 V
Environmental
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
Airflow
Velocity
(m/sec)
Ψ
Unit
0
22.3
1.4
N/A
0.1
°C/W
1.0
19.5
N/A
11.8
0.2
°C/W
64-Lead
LFCSP
9 mm × 9 mm
(CP-64-4)
2.5
17.5
N/A
0.2
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
ESD CAUTION
1 The inputs and outputs are rated to the supply voltage (AVDD or DRVDD)
+
0.2 V but should not exceed 2.1 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
相关PDF资料
PDF描述
VI-BTK-IV-F2 CONVERTER MOD DC/DC 40V 150W
LTC1278-5CSW#PBF IC A/DCONV SAMPLNG W/SHTDN24SOIC
LTC1278-5CSW IC A/DCONV SAMPLNG W/SHTDN24SOIC
VI-BTJ-IV-F4 CONVERTER MOD DC/DC 36V 150W
AD7777ARZ IC ADC 10BIT 4CH HS 28SOIC
相关代理商/技术参数
参数描述
AD9608BCPZ-125 功能描述:IC ADC DUAL 10BIT 64-LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 其它有关文件:TSA1204 View All Specifications 标准包装:1 系列:- 位数:12 采样率(每秒):20M 数据接口:并联 转换器数目:2 功率耗散(最大):155mW 电压电源:模拟和数字 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP(7x7) 包装:Digi-Reel® 输入数目和类型:4 个单端,单极;2 个差分,单极 产品目录页面:1156 (CN2011-ZH PDF) 其它名称:497-5435-6
AD9608BCPZRL7-105 功能描述:IC ADC 10BIT 105MSPS 64LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率(每秒):300k 数据接口:并联 转换器数目:1 功率耗散(最大):75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC(0.295",7.50mm 宽) 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端,单极;1 个单端,双极
AD9608BCPZRL7-125 功能描述:IC ADC 10BIT 125MSPS 64LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:- 位数:14 采样率(每秒):83k 数据接口:串行,并联 转换器数目:1 功率耗散(最大):95mW 电压电源:双 ± 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:28-DIP(0.600",15.24mm) 供应商设备封装:28-PDIP 包装:管件 输入数目和类型:1 个单端,双极
AD9609 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS 1.8 V Analog-to-Digital Converter
AD9609-20EBZ 功能描述:BOARD EVALUATION AD9609 20MSPS RoHS:是 类别:编程器,开发系统 >> 评估板 - 模数转换器 (ADC) 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- ADC 的数量:1 位数:12 采样率(每秒):94.4k 数据接口:USB 输入范围:±VREF/2 在以下条件下的电源(标准):- 工作温度:-40°C ~ 85°C 已用 IC / 零件:MAX11645 已供物品:板,软件