参数资料
型号: AD9912ABCPZ
厂商: Analog Devices Inc
文件页数: 39/40页
文件大小: 0K
描述: IC DDS 1GSPS DAC 14BIT 64LFCSP
产品培训模块: Direct Digital Synthesis Tutorial Series (1 of 7): Introduction
Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action
Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter
Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction
Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter
Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator
标准包装: 1
分辨率(位): 14 b
主 fclk: 1GHz
调节字宽(位): 48 b
电源电压: 1.8V, 3.3V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 托盘
AD9912
Rev. F | Page 8 of 40
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Analog Supply Voltage (AVDD)
2 V
Digital Supply Voltage (DVDD)
2 V
Digital I/O Supply Voltage
(DVDD_I/O)
3.6 V
DAC Supply Voltage (AVDD3 Pins)
3.6 V
Maximum Digital Input Voltage
0.5 V to DVDD_I/O + 0.5 V
Storage Temperature
65°C to +150°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
64-Lead LFCSP
25.2
13.9
1.7
°C/W typical
Note that the exposed pad on the bottom of package must be
soldered to ground to achieve the specified thermal performance.
See the Typical Performance Characteristics section for more
information.
ESD CAUTION
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