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参数资料
| 型号： | ADCLK846/PCBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADCLK846 |
| 设计资源： | Synchronizing Multiple AD9910 1 GSPS Direct Digital Synthesizers (CN0121) |
| 标准包装： | 1 |
| 主要目的： | 计时，时钟缓冲器 / 驱动器 / 接收器 / 变换器 |
| 已用 IC / 零件： | ADCLK846 |
| 主要属性： | 6 LVDS/12 CMOS 输出 |
| 次要属性： | CMOS，LVDS 输出 |
| 已供物品： | 板 |
ADCLK846
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
VS to GND
2 V
Inputs
CLK and CLK
0.3 V to +2 V
CMOS Inputs
0.3 V to +2 V
Outputs
Maximum Voltage
0.3 V to +2 V
Voltage Reference Voltage (VREF)
0.3 V to +2 V
Operating Temperature Range
Ambient
40°C to +85°C
Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application PCB,
use the following formula:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
top center of the package.
PD is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided for package comparison and PCB
design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter
Symbol
Description
Value1
Unit
Junction-to-Ambient Thermal Resistance
θ
JA
Still Air
Per JEDEC JESD51-2
0.0 m/sec Airflow
57.0
°C/W
Moving Air
θ
JMA
Per JEDEC JESD51-6
1.0 m/sec Airflow
49.8
°C/W
2.5 m/sec Airflow
44.7
°C/W
Junction-to-Board Thermal Resistance
θ
JB
Moving Air
Per JEDEC JESD51-8
1.0 m/sec Airflow
35.2
°C/W
Junction-to-Case Thermal Resistance
θ
JC
Moving Air
Per MIL-STD 883, Method 1012.1
Die-to-Heat Sink
2.0
°C/W
Junction-to-Top-of-Package Characterization Parameter
ΨJT
Still Air
Per JEDEC JESD51-2
0 m/sec Airflow
1.0
°C/W
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
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| ADCLK905 | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultrafast SiGe ECL Clock/Data Buffers |
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