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参数资料
| 型号： | ADN2526ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC LASER DRIVER 11.3GBPS 16LFCSP |
| 标准包装： | 1,500 |
| 类型： | 激光二极管驱动器 |
| 数据速率： | 11.3Gbps |
| 通道数： | 1 |
| 电源电压： | 3 V ~ 3.6 V |
| 电流 - 电源： | 46mA |
| 电流 - 调制： | 80mA |
| 电流 - 偏置： | 100mA |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
MODULE CASE
Data Sheet
CROSSPOINT ADJUSTMENT
The optical eye cross point is adjustable between 35% and 65%
using the cross point adjust (CPA) control input. The equivalent
circuit for the CPA pin is shown in Figure 31. In a default CPA
setting, leave CPA unconnected (maintain pin-to-pin compatibil-
ity with the ADN2525 ). The internal bias circuit presents about
ADN2526
junction-to-ambient thermal resistance (θ JA ) do not yield
accurate results.
THERMAL COMPOUND
T TOP
1.9 V at the CPA pin and the eye cross point is set to 50%. To set
the cross point at various points, apply an external voltage to the
CPA pin.
DIE
PACKAGE
T J
T PAD
THERMOCOUPLE
PCB
COPPER PLANE
VIAS
7k?
VCC
7k?
7k?
Figure 32. Typical Optical Module Structure
The parameters in Table 6 can be used to estimate the IC
junction temperature.
Table 6. Definitions
CPA
Figure 31. Equivalent Circuit for CPA Pin
POWER SEQUENCE
To ensure reliable operation, the recommended power-up
sequence is: the supply rail to ADN2526 first, then the BSET
pin, followed by the MSET pin, and, finally, the CPA pin.
To turn off the ADN2526 , the operation is reversed: shut down
CPA first, then MSET, followed by BSET, and, last, the supply rail.
Parameter
T TOP
T PAD
T J
P
θ J-TOP
θ J-PAD
Description
Temperature at the top of the package
Temperature at the package exposed paddle
IC junction temperature
Power dissipation
Thermal resistance from the IC junction to
the package top
Thermal resistance from the IC junction to
the package exposed paddle
Unit
°C
°C
°C
W
°C/W
°C/W
P = VCC × ? MSET + I SUPPLY ? + V IBIAS × IBIAS
θ J ? PAD + θ J ? TOP
POWER CONSUMPTION
The power dissipated by the ADN2526 is given by
? V ?
? 13.5 ?
where:
VCC is the power supply voltage.
V MSET is the voltage applied to the MSET pin.
I SUPPLY is the sum of the currents that flow into VCC, IMODP,
and IMODN, which are sank by the ADN2526 when V BSET =
V IBIAS is the average voltage presented on the IBIAS pin.
T TOP and T PAD can be determined by measuring the temperature
at points inside the module, as shown in Figure 32. The thermo-
couples should be positioned to obtain an accurate measurement
of the package top and paddle temperatures. Using the model
shown in Figure 33, the junction temperature can be calculated by
P × ( θ J ? PAD × θ J ? TOP ) + T TOP × θ J ? PAD + T PAD × θ J ? TOP
T J =
where:
T TOP
Considering V BSET /IBIAS = 10 mV/mA as the conversion factor
θ J-TOP
T TOP
P = VCC × ? MSET + I SUPPLY ? + BSET × V IBIAS
from V BSET to IBIAS, the dissipated power becomes
? V ? V
? 13 . 5 ? 10
To ensure long-term reliable operation, the junction tempera-
P
θ J-PAD
T PAD
ture of the ADN2526 must not exceed 125°C, as specified in
can work as a heat sink, as shown in Figure 32. A compact
optical module is a complex thermal environment, and
calculations of device junction temperature using the package
Rev. B | Page 13 of 16
Figure 33. Electrical Model for Thermal Calculations
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