参数资料
| 型号： | ADN2855ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | IC CLK/RECOVERY MULTI 32LFCSP |
| 标准包装： | 1,500 |
| 类型： | 时钟和数据恢复（CDR） |
| PLL： | 是 |
| 主要目的： | GPON，BPON，GEPON |
| 输入： | CML |
| 输出： | LVDS |
| 电路数： | 1 |
| 比率 - 输入:输出： | 1:2 |
| 差分 - 输入:输出： | 是/是 |
| 频率 - 最大： | 200MHz |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 32-LFCSP-VQ（5x5） |
| 包装： | 带卷 (TR) |
ADN2855
Rev. A | Page 16 of 20
Transmission Lines
Use of 50 transmission lines is required for all high frequency
input and output signals to minimize reflections: PIN, NIN,
CLKOUTP, CLKOUTN, DATxP, DATxN (also REFCLKP and
REFCLKN if a high frequency reference clock is used, such as
155.52 MHz). It is also necessary for the PIN/NIN input traces
to be matched in length, and the CLKOUTP/CLKOUTN and
DATxP/DATxN output traces to be matched in length to avoid
skew between the differential traces. All high speed LVDS outputs,
CLKOUTP/CLKOUTN and DATxP/DATxN, require a 100
differential termination at the differential input to the device
being driven by the ADN2855 outputs.
The high speed inputs, PIN and NIN, are internally terminated
with 50 to an internal reference voltage.
As with any high speed mixed-signal design, take care to keep
all high speed digital traces away from sensitive analog nodes.
Soldering Guidelines for Chip Scale Package
The lands on the 32-lead LFCSP are rectangular. The PCB pad
for these should be 0.1 mm longer than the package land length
and 0.05 mm wider than the package land width. The land
should be centered on the pad to ensure that the solder joint
size is maximized. Visit www.analog.com/CP-32-13 for further
details. The bottom of the chip scale package has a central
exposed pad. The pad on the PCB should be at least as large as
this exposed pad. The user must connect the exposed pad to
VEE (GND) using plugged vias so that solder does not leak
through the vias during reflow. This ensures a solid connection
from the exposed pad to VEE.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADN2855XCPZ | 功能描述:IC CLK DATA REC GPON 200MHZ 制造商:analog devices inc. 系列:- 包装:托盘 零件状态:上次购买时间 PLL:是 主要用途:GPON，BPON，GEPON 输入:CML 输出:LVDS 电路数:1 比率 - 输入:输出:1:1 差分 - 输入:输出:是/是 频率 - 最大值:200MHz 电压 - 电源:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:32-WFQFN 裸露焊盘 供应商器件封装:32-LFCSP-VQ（5x5） 标准包装:1 |
| ADN2860 | 制造商:AD 制造商全称:Analog Devices 功能描述:3-Channel Digital Potentiometer with Nonvolatile Memory |
| ADN2860ACPZ25 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| ADN2860ACPZ250 | 制造商:Analog Devices 功能描述: |
| ADN2860ACPZ250-RL7 | 功能描述:IC POT DGTL 3CH 250K 24-LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:2,500 系列:XDCP™ 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 ±300 ppm/°C 存储器类型:非易失 接口:I²C（设备位址） 电源电压:2.7 V ~ 5.5 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) |
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