参数资料
| 型号： | ADN4605ABPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 47/56页 |
| 文件大小： | 0K |
| 描述： | IC CROSSPOINT SWITCH 352BGA |
| 标准包装： | 1 |
| 系列： | XStream™ |
| 功能： | 交叉点开关 |
| 电路： | 1 x 40:40 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2.25 V ~ 3.6 V |
| 电流 - 电源： | 55mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 352-LBGA 裸露焊盘 |
| 供应商设备封装： | 352-BGA-EP（35x35） |
| 包装： | 托盘 |
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Data Sheet
ADN4605
Rev. A | Page 51 of 56
SUPPLY SEQUENCING
Ideally, all power supplies should be brought up to the appropri-
ate levels simultaneously (power supply requirements are set by
the supply limits in Table 1 and the absolute maximum ratings
listed in Table 6). If the power supplies to the ADN4605 are
brought up separately, the supply power-up sequence is as
follows: DVCC powered first, followed by VCC, and, last the
termination supplies (VTTIA, VTTIB, VTTOA, and VTTOB).
The power-down sequence is reversed with termination
supplies being powered off first. The termination supplies
contain ESD protection diodes to the VCC power domain. To
avoid a sustained high current condition in these devices, the
VTTIx and VTTOx supplies should be powered on after VCC and
should be powered off before VCC.
If the system power supplies have a high impedance in the
powered off state, then supply sequencing is not required
provided the following limits are observed:
Peak current from VTTIxor VTTOx to VCC < 200 mA
Sustained current from VTTIx or VTTOx to VCC < 100 mA
POWER DISSIPATION
The power dissipation of the ADN4605 depends on the supply
voltages, I/O coupling type, and device configuration. The input
termination resistors dissipate power depending on the
differential input swing and common-mode voltage. When ac-
coupled, the common-mode voltage is equal to the termination
supply voltage (VTTIx or VTTOx). While the current drawn from
the input termination supply is effectively zero, there is still
power and heat dissipated in the termination resistors as a result
of the differential signal swing. The core supply current and
output termination current are strongly dependent on device
configuration, such as the number of channels enabled, output
level setting, and output preemphasis setting.
In high ambient temperature operating conditions, it is impor-
tant to avoid exceeding the maximum junction temperature of
the device. Limiting the total power dissipation can be achieved
by the following:
Reducing the output swing
Reducing the preemphasis level
Decreasing the supply voltages within the allowable ranges
defined in Table 1
Disabling unused channels
Alternatively, the thermal resistance can be reduced by
Adding an external heat sink
Increasing the airflow
section for recommendations for proper thermal stencil layout
and fabrication.
OUTPUT COMPLIANCE
In low voltage applications, users must pay careful attention
to both the differential and common-mode signal levels. The
choice of output voltage swing, preemphasis setting, supply
voltages (VCC and VTTOx), and output coupling (ac or dc) affect
peak and settled single-ended voltage swings and the common-
mode shift measured across the output termination resistors.
These choices also affect output current and, consequently,
power consumption.
VCC VOCM) with output level and preemphasis setting. Single-
ended output levels are calculated for VTTOx supplies of 3.3 V
and 2.5 V to illustrate practical challenges of reducing the
supply voltage. The minimum VL (min VL) cannot be below the
absolute minimum level specified in Table 1.
Since the absolute minimum output voltage specified in Table 1
is relative to VCC, decreasing VCC is required to maintain the
output levels within the specified limits when lower output
termination voltages are required. VTTOx voltages as low as 1.8 V
are allowable for output swings less than or equal to 400 mV
(single-ended).
Figure 53 illustrates an application where the ADN4605 is used
as a dc-coupled level translator to interface a 3.3 V CML driver
to an ASIC with 1.8 V I/Os. The diode in series with VCC
reduces the voltage at VCC for improved output compliance.
TX/XPT HEADROOM
The Tx Headroom and XPT Headroom registers are provided
to improve the output compliance range of the ADN4605 when
the core supply voltage (VCC) is greater than 2.7 V. Enabling
the XPT Headroom and Tx Headroom registers allows the
transmitter an extra 300 mV of output compliance. The
headroom circuitry should not be enabled when the core
supply voltage (VCC) is less than or equal to 2.7 V.
When set to 1, the XPT Headroom (Address 0x7D) and Tx
Headroom (Address 0xBB) registers are enabled for all
transmitter outputs. A value of 0 disables the headroom
generating circuitry. Note that both registers (XPT Headroom
and Tx Headroom) must be set for the headroom circuitry to
function properly.
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相关代理商/技术参数 |
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| ADN4605-EVALZ | 功能描述:BOARD EVAL FOR ADN4605 RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:* 标准包装:1 系列:PCI Express® (PCIe) 主要目的:接口，收发器，PCI Express 嵌入式:- 已用 IC / 零件:DS80PCI800 主要属性:- 次要属性:- 已供物品:板 |
| ADN4612 | 制造商:AD 制造商全称:Analog Devices 功能描述:11.3 Gbps 12X12 Digital Crosspoint |
| ADN4612ACPZ | 功能描述:模拟和数字交叉点 IC 12X12 Digital Crosspoint X-Grade RoHS:否 制造商:Micrel 配置:2 x 2 封装 / 箱体:MLF-16 数据速率:10.7 Gbps 输入电平:CML, LVDS, LVPECL 输出电平:CML 电源电压-最大:3.6 V 电源电压-最小:2.375 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 产品:Digital Crosspoint 封装:Tube |
| ADN4650BRSZ | 功能描述:General Purpose Digital Isolator 3750Vrms 2 Channel 600Mbps 25kV/μs CMTI 20-SSOP (0.209", 5.30mm Width) 制造商:analog devices inc. 系列:iCoupler? 包装:托盘 零件状态:在售 技术:磁耦合 类型:通用 隔离式电源:无 通道数:2 输入 - 输入侧 1/输入侧 2:2/0 通道类型:单向 电压 - 隔离:3750Vrms 共模瞬态抗扰度（最小值）:25kV/μs 数据速率:600Mbps 传播延迟 tpLH / tpHL（最大值）:4.5ns，4.5ns 脉宽失真（最大）:- 上升/下降时间（典型值）:350ps，350ps（最大） 电压 - 电源:2.375 V ~ 2.625 V 工作温度:-40°C ~ 125°C 封装/外壳:20-SSOP（0.209"，5.30mm 宽） 供应商器件封装:20-SSOP 标准包装:66 |
| ADN4650BRSZ-RL7 | 功能描述:General Purpose Digital Isolator 3750Vrms 2 Channel 600Mbps 25kV/μs CMTI 20-SSOP (0.209", 5.30mm Width) 制造商:analog devices inc. 系列:iCoupler? 包装:剪切带（CT） 零件状态:在售 技术:磁耦合 类型:通用 隔离式电源:无 通道数:2 输入 - 输入侧 1/输入侧 2:2/0 通道类型:单向 电压 - 隔离:3750Vrms 共模瞬态抗扰度（最小值）:25kV/μs 数据速率:600Mbps 传播延迟 tpLH / tpHL（最大值）:4.5ns，4.5ns 脉宽失真（最大）:- 上升/下降时间（典型值）:350ps，350ps（最大） 电压 - 电源:2.375 V ~ 2.625 V 工作温度:-40°C ~ 125°C 封装/外壳:20-SSOP（0.209"，5.30mm 宽） 供应商器件封装:20-SSOP 标准包装:1 |
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