参数资料
| 型号： | ADP7104ARDZ-3.3-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/28页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .5A 8SOIC |
| 标准包装： | 1,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 20V |
| 电压 - 压降（标准）： | 0.35V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA（最小值） |
| 电流 - 限制（最小）： | 625mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOIC-EP |
| 包装： | 带卷 (TR) |
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ADP7104
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP7104 is protected against damage due to excessive
power dissipation by current and thermal overload protection
circuits. The ADP7104 is designed to current limit when the
output load reaches 600 mA (typical). When the output load
exceeds 600 mA, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and/or
high power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
Data Sheet
To guarantee reliable operation, the junction temperature of
the ADP7104 must not exceed 125°C. To ensure that the
junction temperature stays below this maximum value, the
user must be aware of the parameters that contribute to
junction temperature changes. These parameters include
ambient temperature, power dissipation in the power device,
and thermal resistances between the junction and ambient air
(θ JA ). The θ JA number is dependent on the package assembly
compounds that are used and the amount of copper used to
solder the package GND pins to the PCB.
LFCSP packages for various PCB copper sizes. Table 7 shows
the typical Ψ JB values of the 8-lead SOIC and 8-lead LFCSP.
current to zero. When the junction temperature drops below
135°C, the output is turned on again, and output current is
restored to its operating value.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP7104 current limits, so that only 600 mA
is conducted into the short. If self heating of the junction is
Table 6. Typical θ JA Values
Copper Size (mm 2 )
25 1
100
500
LFCSP
165.1
125.8
68.1
θ JA (°C/W)
SOIC
167.8
111
65.9
Device soldered to minimum size pin traces.
great enough to cause its temperature to rise above 150°C,
thermal shutdown activates, turning off the output and reducing
the output current to zero. As the junction temperature cools
1000 56.4
6400 42.1
1
56.1
45.8
and drops below 135°C, the output turns on and conducts
600 mA into the short, again causing the junction temperature
to rise above 150°C. This thermal oscillation between 135°C
and 150°C causes a current oscillation between 600 mA and
0 mA that continues as long as the short remains at the output.
Table 7. Typical Ψ JB Values
Model
LFCSP
SOIC
Ψ JB (°C/W)
15.1
31.3
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
The junction temperature of the ADP7104 is calculated from the
following equation:
operation, device power dissipation must be externally limited
so the junction temperature does not exceed 125°C.
THERMAL CONSIDERATIONS
In applications with low input-to-output voltage differential, the
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
(2)
ADP7104 does not dissipate much heat. However, in applications
with high ambient temperature and/or high input voltage, the
heat dissipated in the package may become large enough that
it causes the junction temperature of the die to exceed the
maximum junction temperature of 125°C.
When the junction temperature exceeds 150°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 135°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the tempera-
ture rise of the package due to the power dissipation, as shown
in Equation 2.
P D = [( V IN ? V OUT ) × I LOAD ] + ( V IN × I GND ) (3)
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
T J = T A + {[( V IN ? V OUT ) × I LOAD ] × θ JA } (4)
As shown in Equation 4, for a given ambient temperature, input-
to-output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB
to ensure that the junction temperature does not rise above 125°C.
for different ambient temperatures, power dissipation, and areas
of PCB copper.
Rev. F | Page 20 of 28
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| ADP7104ARDZ-5.0-R7 | 功能描述:IC REG LDO 5V .5A 8SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:800 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:最高 16V 电压 - 压降（标准）:0.7V @ 4A 稳压器数量:1 电流 - 输出:4A 电流 - 限制（最小）:4.2A 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6，D²Pak（5 引线+接片），TO-263BA 供应商设备封装:TO-263-5 包装:带卷 (TR) 其它名称:AP1184K525L-13AP1184K525LDITR |
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