参数资料
型号: ADS62P44IRGCT
厂商: Texas Instruments
文件页数: 23/78页
文件大小: 0K
描述: IC ADC 14BIT DUAL 105MSPS 64VQFN
产品培训模块: Data Converter Basics
标准包装: 1
位数: 14
采样率(每秒): 105M
数据接口: 串行,并联
转换器数目: 2
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘
供应商设备封装: 64-VQFN 裸露焊盘(9x9)
包装: 标准包装
输入数目和类型: 2 个差分,单极
其它名称: 296-23137-6
SLAS561C
– JULY 2007 – REVISED FEBRUARY 2012
PACKAGE/ORDERING INFORMATION(1)
SPECIFIED
PACKAGE-
PACKAGE
ORDERING
TRANSPORT MEDIA,
PRODUCT
TEMPERATURE
LEAD
DESIGNATOR
MARKING
NUMBER
QUANTITY
RANGE
ADS62P45IRGCT
Tape and Reel, 250
ADS62P45
QFN-64(2)
RGC
–40°C to 85°C
AZ62P45
ADS62P45IRGCR
Tape and Reel, 2500
ADS62P44IRGCT
Tape and Reel, 250
ADS62P44
QFN-64(2)
RGC
–40°C to 85°C
AZ62P44
ADS62P44IRGCR
Tape and Reel, 2500
ADS62P43IRGCT
Tape and Reel, 250
ADS62P43
QFN-64(2)
RGC
–40°C to 85°C
AZ62P43
ADS62P43IRGCR
Tape and Reel, 2500
ADS62P42IRGCT
Tape and Reel, 250
ADS62P42
QFN-64(2)
RGC
–40°C to 85°C
AZ62P42
ADS62P42IRGCR
Tape and Reel, 2500
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2)
For thermal pad size on the package, see the mechanical drawings at the end of this data sheet.
θJA = 23.17 °C/W (0 LFM air flow),
θJC = 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in × 3 in (7.62 cm ×
7.62 cm) PCB.
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNIT
Supply voltage range, AVDD
–0.3 to 3.9
V
VI
Supply voltage range, DRVDD
–0.3 to 3.9
V
Voltage between AGND and DRGND
–0.3 to 0.3
V
Voltage between AVDD to DRVDD
–0.3 to 3.3
V
Voltage applied to VCM pin (in external reference mode)
–0.3 to 2
V
Voltage applied to analog input pins, INP and INM
–0.3 to minimum ( 3.6, AVDD + 0.3)
V
Voltage applied to analog input pins, CLKP and CLKM
–0.3 to (AVDD + 0.3)
V
TA
Operating free-air temperature range
–40 to 85
°C
TJ
Operating junction temperature range
125
°C
Tstg
Storage temperature range
–65 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright
2007–2012, Texas Instruments Incorporated
3
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