参数资料
型号: ADSP-BF537BBCZ-5B
厂商: Analog Devices Inc
文件页数: 28/68页
文件大小: 0K
描述: IC DSP CTLR 16BIT 208CSPBGA
产品培训模块: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
标准包装: 1
系列: Blackfin®
类型: 定点
接口: CAN,SPI,SSP,TWI,UART
时钟速率: 500MHz
非易失内存: 外部
芯片上RAM: 132kB
电压 - 输入/输出: 2.50V,3.30V
电压 - 核心: 1.26V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 208-LFBGA,CSPBGA
供应商设备封装: 208-CSPBGA
包装: 托盘
配用: ADZS-BF537-ASKIT-ND - BOARD EVAL SKIT ADSP-BF537
ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BF537-EZLITE-ND - BOARD EVAL ADSP-BF537
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADZS-BF537-STAMP-ND - SYSTEM DEV FOR ADSP-BF537
Rev. J
|
Page 34 of 68
|
February 2014
SDRAM Interface Timing
Table 27. SDRAM Interface Timing
Parameter
Min
Max
Unit
Timing Requirements
tSSDAT
DATA15–0 Setup Before CLKOUT
1.5
ns
tHSDAT
DATA15–0 Hold After CLKOUT
0.8
ns
Switching Characteristics
tDCAD
COMMAND
1, ADDR19–1, DATA15–0 Delay After CLKOUT
1 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
4.0
ns
tHCAD
COMMAND
1, ADDR19–1, DATA15–0 Hold After CLKOUT
1.0
ns
tDSDAT
DATA15–0 Disable After CLKOUT
6.0
ns
tENSDAT
DATA15–0 Enable After CLKOUT
0.5
ns
tSCLK
2
2 These limits are specific to the SDRAM interface only. In addition, CLKOUT must always comply with the limits in Table 14 on Page 24.
CLKOUT Period when TJ +105
°C7.5
ns
tSCLK
CLKOUT Period when TJ +105
°C10
ns
tSCLKH
CLKOUT Width High
2.5
ns
tSCLKL
CLKOUT Width Low
2.5
ns
Figure 14. SDRAM Interface Timing
tSCLK
CLKOUT
tSCLKL
tSCLKH
tSSDAT
tHSDAT
tENSDAT
tDCAD
tDSDAT
tHCAD
tDCAD
tHCAD
DATA (IN)
DATA (OUT)
COMMAND,
ADDRESS
(OUT)
NOTE: COMMAND =
SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.
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