参数资料
型号: ADSP-BF561SKB500
厂商: Analog Devices Inc
文件页数: 21/64页
文件大小: 0K
描述: IC DSP CTRLR 32BIT 500MHZ 297BGA
产品培训模块: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
产品变化通告: Product Discontinuance 27/Oct/2011
标准包装: 1
系列: Blackfin®
类型: 定点
接口: SPI,SSP,UART
时钟速率: 500MHz
非易失内存: 外部
芯片上RAM: 328kB
电压 - 输入/输出: 2.50V,3.30V
电压 - 核心: 1.25V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 297-BGA
供应商设备封装: 297-PBGA(27x27)
包装: 托盘
配用: ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BF561-EZLITE-ND - BOARD EVAL ADSP-BF561
ADZS-BF561-MMSKIT-ND - KIT STARTER MULTIMEDIA BF561
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADSP-BF561 
Table 11. Phase-Locked Loop Operating Conditions
Parameter
Voltage Controlled Oscillator (VCO) Frequency
Min
50
Max
Maximum f CCLK
Unit
MHz
Table 12. System Clock (SCLK) Requirements
Parameter 1
Max V DDEXT = 2.5V/3.3V
Unit
f SCLK
f SCLK
CLKOUT/SCLK Frequency (V DDINT ≥ 1.14 V)
CLKOUT/SCLK Frequency (V DDINT < 1.14 V)
133 2
100
MHz
MHz
1
2
t SCLK (= 1/f SCLK ) must be greater than or equal to t CCLK . 
Rounded number. Guaranteed to t SCLK = 7.5 ns. See Table 20 on Page 26
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Typical
Max
Unit
V OH
V OL
I IH
I IHP
I IL 4
I OZH
I OZL 4
High Level Output Voltage 1
Low Level Output Voltage 1
High Level Input Current 2
High Level Input Current JTAG 3
Low Level Input Current 2
Three-State Leakage Current 5
Three-State Leakage Current 5
V DDEXT = 3.0 V, I OH = –0.5 mA
V DDEXT = 3.0 V, I OL = 2.0 mA
V DDEXT = Maximum, V IN = V DD Maximum
V DDEXT = Maximum, V IN = V DD Maximum
V DDEXT = Maximum, V IN = 0 V
V DDEXT = Maximum, V IN = V DD Maximum
V DDEXT = Maximum, V IN = 0 V
2.4
0.4
10.0
50.0
10.0
10.0
10.0
V
V
μA
μA
μA
μA
μA
C IN
I DDHIBERNATE 8
Input Capacitance 6
V DDEXT Current in Hibernate Mode
f IN = 1 MHz, T AMBIENT = 25°C, V IN = 2.5 V
CLKIN=0 MHz, V DDEXT = 3.65 V with Voltage Regulator Off
4
50
8 7
pF
μ A
(V DDINT = 0 V)
I DDDEEPSLEEP 9
I DD _ TYP 9, 10
I DD _ TYP 9, 10
I DD _ TYP 9, 10
V DDINT Current in Deep Sleep Mode
V DDINT Current
V DDINT Current
V DDINT Current
V DDINT = 0.8 V, T JUNCTION = 25°C
V DDINT = 0.8 V, f CCLK = 50 MHz, T JUNCTION = 25°C
V DDINT = 1.25 V, f CCLK = 500 MHz, T JUNCTION = 25°C
V DDINT = 1.35 V, f CCLK = 600 MHz, T JUNCTION = 25°C
70
127
660
818
mA
mA
mA
mA
1
2
3
4
5
6
7
8
9
Applies to output and bidirectional pins. 
Applies to input pins except JTAG inputs. 
Applies to JTAG input pins (TCK, TDI, TMS, TRST). 
Absolute value. 
Applies to three-statable pins. 
Applies to all signal pins. 
Guaranteed, but not tested. 
CLKIN must be tied to V DDEXT or GND during hibernate. 
Maximum current drawn. See Estimating Power for ADSP-BF561 Blackfin Processors (EE-293) on the Analog Devices website ( www.analog.com )—use site search on “EE-293”. 
10
Both cores executing 75% dual MAC, 25% ADD instructions with moderate data bus activity. 
System designers should refer to Estimating Power for the
ADSP-BF561 (EE-293) , which provides detailed information for
optimizing designs for lowest power. All topics discussed in this
section are described in detail in EE-293. Total power dissipa-
tion has two components:
1. Static, including leakage current
2. Dynamic, due to transistor switching characteristics
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro-
cessor activity. Electrical Characteristics on Page 21 shows the
current dissipation for internal circuitry (V DDINT ).
Rev. E |
Page 21 of 64 |
September 2009
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