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参数资料
| 型号： | ADV3227ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC CROSSPOINT SW 16X16 100LFCSP |
| 标准包装： | 1 |
| 功能： | 交叉点开关 |
| 电路： | 1 x 16:16 |
| 电压电源： | 双电源 |
| 电压 - 电源，单路/双路(±)： | ±5V |
| 电流 - 电源： | 125mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 100-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 100ピンLFCSP-VQ（12x12） |
| 包装： | 管件 |
ADV3226/ADV3227
Rev. 0 | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Analog Supply Voltage (AVCC AVEE)
11 V
Digital Supply Voltage (DVCC DGND)
6 V
Supply Potential Difference
(AVCC DVCC)
±0.5 V
Ground Potential Difference
(AGND DGND)
±0.5 V
Maximum Potential Difference
(DVCC AVEE)
6 V
Analog Input Voltage
AVEE < VIN < AVCC
Digital Input Voltage
DGND < DIN < DVCC
Exposed Paddle Voltage
AVEE < VIN < AVCC
Output Voltage (Disabled Analog
Output)
AVEE < VOUT < AVCC
Output Short-Circuit
Duration
Momentary
Current
Internally limited to 55 mA
Temperature
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
Lead Temperature (Soldering,
10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
θJB
ψJT
ψJB
Unit
100-Lead LFCSP
26
2.56
9.5
0.2
8.9
°C/W
POWER DISSIPATION
The ADV3226/ADV3227 operate with ±5 V supplies and can
drive loads down to 100 Ω, resulting in a wide range of possible
power dissipations. For this reason, extra care must be taken
when derating the operating conditions based on ambient
temperature.
Packaged in the 100-lead LFCSP, the ADV3226/ADV3227
junction-to-ambient thermal impedance (θJA) is 26°C/W.
For long-term reliability, the maximum allowed junction
temperature of the die should not exceed 125°C; even
temporarily exceeding this limit can cause a shift in parametric
performance due to a change in stresses exerted on the die by
the package. Exceeding a junction temperature of 150°C for an
extended period can result in device failure. In Figure 4, the
curve shows the range of allowed internal die power dissipation
that meets these conditions over the 40°C to +85°C ambient
temperature range. When using Figure 4, do not include the
external load power in the maximum power calculation, but do
include the load current dropped on the die output transistors.
6
5
4
3
2
15
25
35
45
55
65
75
85
MA
XI
MU
M
P
O
W
E
R
(W
)
AMBIENT TEMPERATURE (°C)
TJ = 150°C
08
65
3-
0
04
Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION
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