参数资料
型号: AGLN030V2-FUCG81
元件分类: FPGA
英文描述: FPGA, PBGA81
封装: 4 X 4 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, UCSP-81
文件页数: 57/114页
文件大小: 3991K
代理商: AGLN030V2-FUCG81
IGLOO nano DC and Switching Characteristics
Ad vance v0.2
2-33
Timing Characteristics
Applies to 1.5 V DC Core Voltage
Applies to 1.2 V DC Core Voltage
Table 2-48 1.8 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
0.97
5.89
0.19
0.99
1.43
0.66
5.20
4.48
1.78
1.30
ns
4 mA
STD
0.97
4.82
0.19
0.99
1.43
0.66
4.39
4.04
2.08
2.07
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
Table 2-49 1.8 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
0.97
2.82
0.19
0.99
1.43
0.66
2.25
1.86
1.78
1.35
ns
4 mA
STD
0.97
2.30
0.19
0.99
1.43
0.66
2.01
1.64
2.08
2.15
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
Table 2-50 1.8 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
1.55
7.30
0.26
1.12
1.43
1.10
6.45
5.82
2.18
1.87
ns
4 mA
STD
1.55
5.88
0.26
1.12
1.43
1.10
5.35
4.98
2.49
2.67
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
Table 2-51 1.8 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V
Drive Strength
Speed Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
2 mA
STD
1.55
4.24
0.26
1.12
1.43
1.10
3.28
3.11
2.18
1.92
ns
4 mA
STD
1.55
3.11
0.26
1.12
1.43
1.10
2.76
2.46
2.49
2.75
ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating
values.
相关PDF资料
PDF描述
AGLN030V2-FVQ100 FPGA, PQFP100
AGLN030V2-FVQG100 FPGA, PQFP100
AGLN030V2-ZFCS81 FPGA, PBGA81
AGLN030V2-ZFCSG81 FPGA, PBGA81
AGLN030V2-ZFQN48 FPGA, PQCC48
相关代理商/技术参数
参数描述
AGLN030V2-ZCSG81 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZCSG81I 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)