参数资料
型号: AGLN030V2-ZCSG81
元件分类: FPGA
英文描述: FPGA, 768 CLBS, 30000 GATES, 250 MHz, PBGA81
封装: 5 X 5 MM, 0.8 MM HEIGHT, 0.5 MM PITCH, GREEN, CSP-81
文件页数: 54/140页
文件大小: 4325K
代理商: AGLN030V2-ZCSG81
IGLOO nano DC and Switching Characteristics
2- 6
R ev isio n 1 0
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
θ
ja(°C/W)
---------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
20.5°C/W
------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
36
TBD
C/W
81
TBD
C/W
Quad Flat No Lead (QFN)
48
TBD
C/W
68
TBD
C/W
100
TBD
C/W
Very Thin Quad Flat Pack (VQFP)
100
10.0
35.3
29.4
27.1
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO nano V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
–20°C
0°C
25°C
70°C
85°C
100°C
1.425
0.947
0.956
0.965
0.978
1.000
1.009
1.013
1.5
0.875
0.883
0.892
0.904
0.925
0.932
0.937
1.575
0.821
0.829
0.837
0.848
0.868
0.875
0.879
相关PDF资料
PDF描述
AGLN030V2-ZQN48I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
AGLN030V2-ZQN48 FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
AGLN030V2-ZQN68I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC68
AGLN030V2-ZQN68 FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC68
AGLN030V2-ZQNG48I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
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AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68I 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)