参数资料
型号: AGLN030V2-ZCSG81
元件分类: FPGA
英文描述: FPGA, 768 CLBS, 30000 GATES, 250 MHz, PBGA81
封装: 5 X 5 MM, 0.8 MM HEIGHT, 0.5 MM PITCH, GREEN, CSP-81
文件页数: 80/140页
文件大小: 4325K
代理商: AGLN030V2-ZCSG81
IGLOO nano DC and Switching Characteristics
2- 30
R e v i sio n 1 0
Timing Characteristics
Applies to 1.5 V DC Core Voltage
Table 2-41 3.3 V LVCMOS Wide Range Low Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.7 V
Drive
Strength
Equivalent
Software
Default
Drive
Strength
Option1
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
100 A
2 mA
STD
0.97
5.23
0.19
1.20
1.66
0.66
5.24
5.00
2.47
2.56
ns
100 A
4 mA
STD
0.97
5.23
0.19
1.20
1.66
0.66
5.24
5.00
2.47
2.56
ns
100 A
6 mA
STD
0.97
4.27
0.19
1.20
1.66
0.66
4.28
4.12
2.83
3.16
ns
100 A
8 mA
STD
0.97
4.27
0.19
1.20
1.66
0.66
4.28
4.12
2.83
3.16
ns
Notes:
1. Note that 3.3 V LVCMOS wide range is applicable to 100 A drive strength only. The configuration will not operate at the
equivalent software default drive strength. These values are for normal ranges only.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-42 3.3 V LVCMOS Wide Range High Slew – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.7 V
Drive
Strength
Equivalent
Software
Default
Drive
Strength
Option1
Speed
Grade
tDOUT
tDP
tDIN
tPY
tPYS
tEOUT
tZL
tZH
tLZ
tHZ
Units
100 A
2 mA
STD
0.97
3.11
0.19
1.20
1.66
0.66
3.13
2.55
2.47
2.70
ns
100 A
4 mA
STD
0.97
3.11
0.19
1.20
1.66
0.66
3.13
2.55
2.47
2.70
ns
100 A
6 mA
STD
0.97
2.56
0.19
1.20
1.66
0.66
2.57
2.02
2.82
3.31
ns
100 A
8 mA
STD
0.97
2.56
0.19
1.20
1.66
0.66
2.57
2.02
2.82
3.31
ns
Notes:
1. Note that 3.3 V LVCMOS wide range is applicable to 100 A drive strength only. The configuration will not operate at the
equivalent software default drive strength. These values are for normal ranges only.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
3. Software default selection highlighted in gray.
相关PDF资料
PDF描述
AGLN030V2-ZQN48I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
AGLN030V2-ZQN48 FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
AGLN030V2-ZQN68I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC68
AGLN030V2-ZQN68 FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC68
AGLN030V2-ZQNG48I FPGA, 768 CLBS, 30000 GATES, 250 MHz, QCC48
相关代理商/技术参数
参数描述
AGLN030V2-ZCSG81I 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN030V2-ZQNG68I 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)