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参数资料
型号： APA150-BG456
厂商： Microsemi SoC
文件页数： 82/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 150K 456-PBGA
标准包装： 24
系列： ProASICPLUS
RAM 位总计： 36864
输入/输出数： 242
门数： 150000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 456-BBGA
供应商设备封装： 456-PBGA（35x35）
ProASICPLUS Flash Family FPGAs
4- 4
v5.9
v3.2
The "ProASICPLUS Clock Management System" section was updated.
2-10
Figure 2-11 PLL Block – Top-Level View and Detailed PLL Block Diagram was updated.
2-11
Table 2-7 Clock-Conditioning Circuitry MUX Settings is new.
2-12
Figure 2-17 Using the PLL for Clock Deskewing was updated.
2-16
The "PLL Electrical Specifications" section was updated.
2-18
Figure 2-23 Tristate Buffer Delays was updated.
2-42
In the "Calculating Typical Power Dissipation" section, P9 was changed to 7.5 mW.
2-28
The "Programming, Storage, and Operating Limits" section was updated.
2-31
The "Recommended Design Practice for VPN/VPP" section was updated.
2-74
v3.1
The datasheet was updated to include references to guidelines concerning the use of certain
ProASICPLUS I/O standards.
v3.0
In Table 2-2 Array Coordinates, the Memory Rows – Bottom coordinates were changed.
2-5
Figure 2-5 Core Cell Coordinates for the APA1000 was updated.
2-5
The VIL Minimum in the Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD
= 2.5 V ±0.2 V) Applies to Military Temperature and MIL-STD-883B Temperature Only was
changed from 0.3 to –0.3.
2-38
In the "Output Buffer Delays" section, the OB25LPLL tDHL Standard changed to 5.3.
2-44
In the "Sample Macrocell Library Listing" section, the AND2 Standard maximum changed to 0.7
and the –F maximum changed to 0.8.
2-51
v2.0
The Table 1 ProASICPLUS Product Profile was updated.
i
The "Ordering Information" section was updated.
ii
The "Plastic Device Resources" section was updated.
ii
The "ProASICPLUS Architecture" section was updated.
1-2
Table 2-2 Array Coordinates was updated.
2-5
Figure 2-5 Core Cell Coordinates for the APA1000 is new.
2-13
Figure 2-8 LVPECL High and Low Threshold Values is new.
2-7
The Introduction section in the "ProASICPLUS Clock Management System" section was updated.
2-10
The "Physical Implementation" section was updated.
2-10
The "Functional Description" section was updated.
2-10
Figure 2-11 PLL Block – Top-Level View and Detailed PLL Block Diagram through Figure 2-
17 Using the PLL for Clock Deskewing were updated.
2-11 to 2-16
The "PLL Electrical Specifications" section was updated.
2-18
Figure 2-22 Multi-Port Memory Usage was updated.
2-24
The "Calculating Typical Power Dissipation" section was updated.
2-28
The "Nominal Supply Voltages’ section was updated.
1-34
The Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)
Applies to Military Temperature and MIL-STD-883B Temperature Only was updated.
2-38
The "Tristate Buffer Delays" section was updated.
2-42
The "Output Buffer Delays" section was updated.
2-44
The"Input Buffer Delays" section was updated.
2-46
"Global Routing Skew" section was updated.
2-50
The"Sample Macrocell Library Listing" section was updated.
2-51
The "Pin Description" section was updated.
2-73
Previous version
Changes in current version (v5.9)
Page
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PDF描述
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APA150-BGG456 IC FPGA PROASIC+ 150K 456-PBGA
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相关代理商/技术参数
参数描述
APA150-BG456I 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
APA150-BGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA150-BGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA150-BGG456 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
APA150-BGG456I 功能描述:IC FPGA PROASIC+ 150K 456-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27）
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