参数资料
型号: APA150-FGG144
厂商: Microsemi SoC
文件页数: 129/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 144-FBGA
标准包装: 160
系列: ProASICPLUS
RAM 位总计: 36864
输入/输出数: 100
门数: 150000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
ProASICPLUS Flash Family FPGAs
2- 44
v5.9
Output Buffer Delays
Figure 2-24 Output Buffer Delays
Table 2-31 Worst-Case Commercial Conditions
VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max. tDLH
1
Max. tDHL
2
Units
Std.
OB33PH
3.3 V, PCI Output Current, High Slew Rate
2.0
2.2
ns
OB33PN
3.3 V, High Output Current, Nominal Slew Rate
2.2
2.9
ns
OB33PL
3.3 V, High Output Current, Low Slew Rate
2.5
3.2
ns
OB33LH
3.3 V, Low Output Current, High Slew Rate
2.6
4.0
ns
OB33LN
3.3 V, Low Output Current, Nominal Slew Rate
2.9
4.3
ns
OB33LL
3.3 V, Low Output Current, Low Slew Rate
3.0
5.6
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
Table 2-32 Worst-Case Commercial Conditions
VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max. tDLH
1
Max. tDHL
2
Units
Std.
OB25LPHH
2.5 V, Low Power, High Output Current, High Slew Rate3
2.0
2.1
ns
OB25LPHN
2.5 V, Low Power, High Output Current, Nominal Slew Rate3
2.4
3.0
ns
OB25LPHL
2.5 V, Low Power, High Output Current, Low Slew Rate3
2.9
3.2
ns
OB25LPLH
2.5 V, Low Power, Low Output Current, High Slew Rate3
2.7
4.6
ns
OB25LPLN
2.5 V, Low Power, Low Output Current, Nominal Slew Rate3
3.5
4.2
ns
OB25LPLL
2.5 V, Low Power, Low Output Current, Low Slew Rate3
4.0
5.3
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
3. Low-power I/Os work with VDDP = 2.5 V ±10% only. VDDP = 2.3 V for delays.
Table 2-33 Worst-Case Military Conditions
VDDP = 3.0V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883
Macro Type
Description
Max.
tDLH
1
Max.
tDHL
2
Units
Std.
OB33PH
3.3V, PCI Output Current, High Slew Rate
2.1
2.3
ns
OB33PN
3.3V, High Output Current, Nominal Slew Rate
2.5
3.2
ns
PAD
A
50%
PAD
VOL
V
OH
50%
t
DLH
50%
t
DHL
35 pF
A
OBx
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