参数资料
型号: APA600-FGG676
厂商: Microsemi SoC
文件页数: 101/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 676-FBGA
标准包装: 40
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 454
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
v5.9
2-19
PLL I/O Constraints
PLL locking is guaranteed only when the following constraints are followed:
Table 2-10 PLL I/O Constraints
TJ –40°C
Value TJ > –40°C
I/O Type
PLL locking is guaranteed only when using low drive strength and
low slew rate I/O. PLL locking may be inconsistent when using high
drive strength or high slew rate I/Os
No Constraints
SSO
APA300
Hermetic packages
8 SSO
With FIN
180 MHz and
outputs
switching
simultaneously
Plastic packages
16 SSO
APA600
Hermetic packages
16 SSO
Plastic packages
32 SSO
APA1000
Hermetic packages
16 SSO
Plastic packages
32 SSO
APA300
Hermetic packages
12 SSO
With FIN
50 MHz and half
outputs switching on positive
clock edge, half switching on
the negative clock edge no less
than 10 ns later
Plastic packages
20 SSO
APA600
Hermetic packages
32 SSO
Plastic packages
64 SSO
APA1000
Hermetic packages
32 SSO
Plastic packages
64 SSO
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APA600-FGG676I 功能描述:IC FPGA PROASIC+ 600K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
APA600-FGGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
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