参数资料
型号: APA600-FGG676I
厂商: Microsemi SoC
文件页数: 117/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 676-FBGA
标准包装: 40
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 454
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
v5.9
2-33
Table 2-20 Recommended Maximum Operating Conditions Programming and PLL Supplies
Parameter
Condition
Commercial/Industrial/Military/MIL-STD-883
Units
Minimum
Maximum
VPP
During Programming
15.8
16.5
V
Normal Operation1
016.5
V
VPN
During Programming
–13.8
–13.2
V
Normal Operation2
–13.8
0.5
V
IPP
During Programming
25
mA
IPN
During Programming
10
mA
AVDD
VDD
V
AGND
GND
V
Notes:
1. Please refer to the "VPP Programming Supply Pin" section on page 2-74 for more information.
2. Please refer to the "VPN Programming Supply Pin" section on page 2-74 for more information.
Table 2-21 Recommended Operating Conditions
Parameter
Symbol
Limits
Commercial
Industrial
Military/MIL-STD-883
DC Supply Voltage (2.5 V I/Os)
VDD and VDDP
2.5 V
± 0.2 V
2.5 V
± 0.2 V
2.5 V
± 0.2 V
DC Supply Voltage (3.3 V I/Os)
VDDP
VDD
3.3 V
± 0.3 V
2.5 V
± 0.2 V
3.3 V
± 0.3 V
2.5 V
± 0.2 V
3.3 V
± 0.3 V
2.5 V
± 0.2 V
Operating Ambient Temperature Range
TA, TC
0°C to 70°C
–40°C to 85°C
–55°C (TA) to 125°C (TC)
Maximum Operating Junction Temperature
TJ
110°C
150°C
Note: For I/O long-term reliability, external pull-up resistors cannot be used to increase output voltage above VDDP.
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