参数资料
型号: APA600-FGG676I
厂商: Microsemi SoC
文件页数: 137/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 676-FBGA
标准包装: 40
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 454
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
v5.9
2-51
Module Delays
Sample Macrocell Library Listing
Figure 2-26 Module Delays
Table 2-47 Worst-Case Military Conditions1
VDD = 2.3 V, TJ = 70 C, TJ = 70°C, TJ = 125°C for Military/MIL-STD-883
Cell Name
Description
Std.
Max
Min
Units
NAND2
2-Input NAND
0.5
ns
AND2
2-Input AND
0.7
ns
NOR3
3-Input NOR
0.8
ns
MUX2L
2-1 MUX with Active Low Select
0.5
ns
OA21
2-Input OR into a 2-Input AND
0.8
ns
XOR2
2-Input Exclusive OR
0.6
ns
LDL
Active Low Latch (LH/HL)
LH2
0.9
ns
CLK-Q
HL2
0.8
ns
tsetup
0.7
ns
thold
0.1
ns
DFFL
Negative Edge-Triggered D-type Flip-Flop (LH/HL)
CLK-Q
LH2
0.9
ns
HL2
0.8
ns
tsetup
0.6
ns
thold
0.0
ns
Notes:
1. Intrinsic delays have a variable component, coupled to the input slope of the signal. These numbers assume an input slope typical of
local interconnect.
2. LH and HL refer to the Q transitions from Low to High and High to Low, respectively.
A
B
50%
Y
50%
50% 50%
50%
C
50%50%
50%
t
DALH
t
DBLH
t
DAHL
t
DBHL
t
DCHL
t
DCLH
A
B
C
Y
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