参数资料
型号: APA600-FGG676I
厂商: Microsemi SoC
文件页数: 119/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 600K 676-FBGA
标准包装: 40
系列: ProASICPLUS
RAM 位总计: 129024
输入/输出数: 454
门数: 600000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
ProASICPLUS Flash Family FPGAs
v5.9
2-35
IOSL
Output Short Circuit Current Low
High Drive (OB25LPH)
Low Drive (OB25LPL)
VIN = VDDP
100
30
mA
CI/O
I/O Pad Capacitance
10
pF
CCLK
Clock Input Pad Capacitance
10
pF
Table 2-22 DC Electrical Specifications (VDDP = 2.5 V ±0.2V) (Continued)
Symbol
Parameter
Conditions
Commercial/Industrial/
Military/MIL-STD-8831, 2
Min.
Typ.
Max.
Units
Notes:
1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.
2. All process conditions. Military: Junction Temperature: –55 to +150°C.
3. During transitions, the input signal may overshoot to VDDP +1.0V for a limited time of no larger than 10% of the duty cycle.
4. During transitions, the input signal may undershoot to -1.0V for a limited time of no larger than 10% of the duty cycle.
5. No pull-up resistor.
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