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参数资料
型号： APA750-FG896
厂商： Microsemi SoC
文件页数： 81/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 750K 896-FBGA
标准包装： 27
系列： ProASICPLUS
RAM 位总计： 147456
输入/输出数： 562
门数： 750000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 896-BGA
供应商设备封装： 896-FBGA（31x31）
ProASICPLUS Flash Family FPGAs
v5.9
4-3
v4.1
(continued)
Figure 2-27 JTAG Operation Timing is new.
2-53
Note 1 in Table 2-52 TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/Industrial was
updated.
2-55
The notes in Table 2-56 TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/Industrial
were updated.
2-59
A note was added to Figure 2-45 FIFO Reset.
2-72
A note was added to Table 2-68 TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/
Industrial.
2-72
The "TRST Test Reset Input" section was updated in the "Pin Description" section.
2-73
The "624-Pin CCGA/LGA" section was updated for the APA600 and APA1000. Please review all
pin data.
3-78
v4.0
Figure 2-17 Using the PLL for Clock Deskewing was updated.
2-16
Table 2-48 Recommended Operating Conditions was updated.
2-52
The "1152-Pin FBGA" figure was updated.
3-69
Pin names were changed to more accurately reflect the multiple functions supported by each
pin.
v3.5
The ProASICPLUS and ProASICPLUS Military/Aerospace datasheets were combined. This
document now supports Commercial, Industrial, and Military Temperature devices.
Table 1 ProASICPLUS Product Profile was updated.
i
The "Ordering Information" section was updated.
ii
"Plastic Device Resources" table was updated.
ii
The Long Term Jitter Peak-to-Peak Max. in the "PLL Electrical Specifications" table was updated.
2-18
The "Calculating Typical Power Dissipation" section was updated.
2-28
"Performance Retention" section
2-31
Table 2-19 Military Temperature Grade Product Performance Retention
2-32
Table 2-21 Recommended Operating Conditions was updated.
2-33
Table 2-22 DC Electrical Specifications (VDDP = 2.5 V ±0.2V) was updated.
2-34
Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) Applies
to Military Temperature and MIL-STD-883B Temperature Only was updated.
2-38
Table 2-48 Recommended Operating Conditions was updated.
2-52
v3.4
The "Temperature Grade Offerings" table is new.
iv
The "Speed Grade and Temperature Matrix" table is new.
iv
The "ProASICPLUS Clock Management System" section was updated.
2-10
The "Lock Signal" section was updated.
2-13
The "PLL Electrical Specifications" table was updated.
2-18
The "User Security" section was updated.
2-20
The "Design Environment" section was updated.
2-25
Table 2-16 Package Thermal Characteristics was updated.
2-27
The "Asynchronous FIFO Full and Empty Transitions" section was updated.
2-65
The "AVDD PLL Power Supply" section in the "Pin Description" section was updated.
2-73
v3.3
The "144-Pin TQFP" table was updated. The following pins changed:
Pin 15 = GLMX1
Pin 16 = GL1
Pin 21 = GL2
Pin 88 = GL3
Pin93 = GL4
Pin 94 = GLMX2
3-4
Previous version
Changes in current version (v5.9)
Page
相关PDF资料
PDF描述
APA750-FGG896 IC FPGA PROASIC+ 750K 896-FBGA
HSC49DRYN-S93 CONN EDGECARD 98POS DIP .100 SLD
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170-015-172L000 CONN DB15 CRIMP MALE TIN
HSC49DRYH-S93 CONN EDGECARD 98POS DIP .100 SLD
相关代理商/技术参数
参数描述
APA750-FG896A 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA750-FG896I 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA750-FGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGG676 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
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