参数资料
| 型号： | AT24C02C-XHM-T |
| 厂商： | Atmel |
| 文件页数： | 18/23页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 2KBIT 1MHZ 8TSSOP |
| 标准包装： | 1 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 2K (256 x 8) |
| 速度： | 400kHz，1MHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-TSSOP |
| 包装： | 剪切带 (CT) |
| 其它名称： | AT24C02C-XHM-TCT |
13.3
8X — 8-lead TSSOP
1
Pin 1 indicator
this corner
C
E1
E
L1
N
L
Top View
b
e
A2
A
A1
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
D
Side View
SYMBOL
A
A1
MIN
-
0.05
NOM
-
-
MAX
1.20
0.15
NOTE
Notes:
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
A2
0.80
1.00
1.05
dimensions, tolerances, datums, etc.
D
2.90
3.00
3.10
2, 5
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
E
6.40 BSC
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
E1
b
4.30
0.19
4.40
–
4.50
0.30
3, 5
4
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
e
0.65 BSC
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
L
L1
0.45
0.60
1.00 REF
0.75
space between protrusion and adjacent lead is 0.07mm.
C
0.09
-
0.20
5. Dimension D and E1 to be determined at Datum Plane H.
6/22/11
TITLE
GPC
DRAWING NO.
REV.
Package Drawing Contact:
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TNR
8X
D
packagedrawings@atmel.com
Atmel AT24C01C/02C [DATASHEET]
8700F–SEEPR–6/12
18
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AT24C02D-CUM-T | 功能描述:IC EEPROM 2KBIT 1MHZ 8VFBGA 制造商:microchip technology 系列:- 包装:带卷（TR） 零件状态:在售 存储器类型:非易失 存储器格式:EEPROM 技术:EEPROM 存储容量:2Kb （256 x 8） 时钟频率:1MHz 写周期时间 - 字，页:5ms 访问时间:4.5μs 存储器接口:I2C 电压 - 电源:1.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C（TC） 安装类型:表面贴装 封装/外壳:8-VFBGA 供应商器件封装:8-VFBGA（1.5x2） 标准包装:5,000 |
| AT24C02D-MAHM-T | 制造商:Atmel Corporation 功能描述:Atmel AT24C02D-MAHM-T EEPROM 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8MINIMAP |
| AT24C02D-PUM | 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8DIP |
| AT24C02D-SSHM-B | 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8SOIC |
| AT24C02D-SSHM-T | 制造商:Atmel Corporation 功能描述:Atmel AT24C02D-SSHM-T EEPROM |
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