参数资料
| 型号： | AT24C02C-XHM-T |
| 厂商： | Atmel |
| 文件页数： | 20/23页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 2KBIT 1MHZ 8TSSOP |
| 标准包装： | 1 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 2K (256 x 8) |
| 速度： | 400kHz，1MHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-TSSOP |
| 包装： | 剪切带 (CT) |
| 其它名称： | AT24C02C-XHM-TCT |
13.5
5TS1 — 5-lead SOT23
e1
E1
5
4
E
C
C L
L1
1
2
TOP VIEW
b
3
A2
A
END VIEW
SEATING
PLANE
e
A1
D
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
SYMBOL
A
A1
A2
c
D
E
E1
MIN
-
0.00
0.70
0.08
NOM
-
-
0.90
-
2.90 BSC
2.80 BSC
1.60 BSC
MAX
1.00
0.10
1.00
0.20
NOTE
3
1,2
1,2
1,2
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
L1
e
0.60 REF
0.95 BSC
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
e1
b
1.90 BSC
0.30 -
0.50
3,4
5/31/12
TITLE
GPC
DRAWING NO.
REV.
Package Drawing Contact:
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
TSZ
5TS1
D
packagedrawings@atmel.com
Atmel AT24C01C/02C [DATASHEET]
8700F–SEEPR–6/12
20
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AT24C02D-CUM-T | 功能描述:IC EEPROM 2KBIT 1MHZ 8VFBGA 制造商:microchip technology 系列:- 包装:带卷（TR） 零件状态:在售 存储器类型:非易失 存储器格式:EEPROM 技术:EEPROM 存储容量:2Kb （256 x 8） 时钟频率:1MHz 写周期时间 - 字，页:5ms 访问时间:4.5μs 存储器接口:I2C 电压 - 电源:1.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C（TC） 安装类型:表面贴装 封装/外壳:8-VFBGA 供应商器件封装:8-VFBGA（1.5x2） 标准包装:5,000 |
| AT24C02D-MAHM-T | 制造商:Atmel Corporation 功能描述:Atmel AT24C02D-MAHM-T EEPROM 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8MINIMAP |
| AT24C02D-PUM | 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8DIP |
| AT24C02D-SSHM-B | 制造商:Atmel Corporation 功能描述:IC EEPROM 2KBIT 1MHZ 8SOIC |
| AT24C02D-SSHM-T | 制造商:Atmel Corporation 功能描述:Atmel AT24C02D-SSHM-T EEPROM |
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