参数资料
型号: AT25256B-XHL-T
厂商: Atmel
文件页数: 17/24页
文件大小: 0K
描述: IC EEPROM 256KBIT 20MHZ 8TSSOP
标准包装: 1
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 5MHz,10MHz,20MHz
接口: SPI 3 线串行
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 剪切带 (CT)
其它名称: AT25256B-XHL-TCT
Atmel AT25128B/256B
7.
Ordering Codes
Atmel AT25128B Ordering Information
Ordering Code
Voltage Range
Package
Operation Range
AT25128B-SSHL-B
(1)
(NiPdAu Lead Finish)
1.8V to 5.5V
8S1
AT25128B-SSHL-T (2) (NiPdAu Lead Finish)
1.8V to 5.5V
8S1
AT25128B-XHL-B (1) (NiPdAu Lead Finish)
AT25128B-XHL-T (2) (NiPdAu Lead Finish)
AT25128B-MAHL-T (2) (NiPdAu Lead Finish)
AT25128B-CUL-T (2) (SnAgCu Ball Finish)
AT25128B-WWU11L (3)
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
1.8V to 5.5V
8A2
8A2
8MA2
8U2-1
Die Sale
Lead-free/Halogen-free/
Industrial Temperature
(?40°C to 85°C)
Industrial Temperature
(?40°C to 85°C)
Notes:
8S1
8A2
8MA2
8U2-1
1. Bulk delivery in tubes (SOIC and TSSOP 100/tube)
2. Tape and reel delivery (SOIC 4k/reel. TSSOP, UDFN and VFBGA 5k/reel)
3. Contact Atmel Sales for Wafer sales
Package Type
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN)
8-ball, die Ball Grid Array Package (VFBGA)
17
8698C–SEEPR–8/11
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