参数资料
型号: BD3512MUV-E2
厂商: Rohm Semiconductor
文件页数: 2/17页
文件大小: 0K
描述: IC REG LDO ADJ 3A 20QFN
标准包装: 2,500
稳压器拓扑结构: 正,可调式
输出电压: 0.65 V ~ 2.7 V
输入电压: 0.7 V ~ 5.5 V
电压 - 压降(标准): 0.065V @ 1A
稳压器数量: 1
电流 - 输出: 3A(最小)
工作温度: -10°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 20-VFQFN 裸露焊盘
供应商设备封装: VQFN020V4040
包装: 带卷 (TR)
● Absolute maximum ratings (Ta=25 ℃ )
6.0 *
Parameter
Input Voltage 1
Input Voltage 2
Input Voltage 3
Input Voltage 4
Maximum Output Current
Enable Input Voltage
PGOOD Input Voltage
Power Dissipation 1
Power Dissipation 2
Power Dissipation 3
Power Dissipation 4
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Symbol
VCC
VIN
VCC
VD
IO
Ven
V PGOOD
Pd1
Pd2
Pd3
Pd4
Topr
Tstg
Tjmax
Limit
1
6.0 * 1
6.0 * 1
1
3 * 1
6.0
6.0
0.34 *2
0.70 *3
1.21 *4
3.56 *5
-10 ~ +100
-55 ~ +125
+150
Unit
V
V
V
V
A
V
V
W
W
W
W
* 1 Should not exceed Pd.
* 2 Reduced by 2.7mW/ ℃ for each increase in Ta ≧ 25 ℃ (no heat sink)
* 3 Reduced by 5.6mW for each increase in Ta of 1 ℃ over 25 ℃ . (when mounted on a board 74.2mm × 74.2mm × 1.6mm Glass-epoxy PCB.)
:No substrate surface copper foil area.
* 4 Reduced by 9.7mW for each increase in Ta of 1 ℃ over 25 ℃ . (when mounted on a board 74.2mm × 74.2mm × 1.6mm Glass-epoxy PCB.)
:4 layers, substrate surface copper foil area 10.29mm 2 .
* 5 Reduced by 28.5mW for each increase in Ta of 1 ℃ over 25 ℃ . (when mounted on a board 74.2mm × 74.2mm × 1.6mm Glass-epoxy PCB.)
:4 layers, substrate surface copper foil area 5505mm 2 .
● Operating Voltage (Ta=25 ℃ )
Parameter
Input Voltage 1
Input Voltage 2
Input Voltage 3
Output Voltage Setting Range
Enable Input Voltage
Symbol
VCC
VIN
VCC
Vo
Ven
Min.
4.3
0.7
4.5
VFB
-0.3
Max.
5.5
VCC-1 * 6
5.5
2.7
5.5
Unit
V
V
V
V
V
*6
VCC and VIN do not have to be implemented in the order listed.
★ This product is not designed for use in radioactive environments.
2/16
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