参数资料
| 型号： | BD9011EKN-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 26/30页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BST PWM 36-HQFN |
| 标准包装： | 1 |
| PWM 型： | 控制器 |
| 输出数： | 2 |
| 频率 - 最大： | 550kHz |
| 电源电压： | 3.9 V ~ 30 V |
| 降压： | 是 |
| 升压： | 是 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 36-TQFN 裸露焊盘 |
| 包装： | 标准包装 |
| 产品目录页面： | 1372 (CN2011-ZH PDF) |
| 其它名称： | BD9011EKN-E2DKR |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页当前第26页第27页第28页第29页第30页
DTC1(8),DTC2(9)
CTL1(12),CTL2(13)
SYNC(15)
VREGA
VCC
VREGA
VREF
VCC
VREGA
VCC
VREF
VCC
SYNC
DTC1,2
，
CTL1,2
SYNC
SCP(19)
OUT2L(17),VREGA(18)
VREF(7)
VREF
VCC
VC
VREF
VCC
VCC
VCC
VREGA
VREGA
OUT2L
SCP
OUT2L
～ ～
VREF
VCC
PVCC1(26),PVCC2(22)
OUT1(25),OUT2H(23),VREGB(24)
VCC
VS1(28),VS2(20),CL1(27),CL2(21)
VCC
PVCC1,2
OUT1,2H
CL1,2
VS1,2
PVCC1 ， 2
OUTH1 ， 2H
CL1 ， 2
VREGB
VS1 ， 2
Fig.8
● Operation Notes (BD9775FV)
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC deterioration
or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered.
A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings
may be exceeded is anticipated.
2) GND potential
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry a voltage lower
than or equal to the GND pin, including during actual transient phenomena.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC.
Shorts between output pins or between output pins and the power supply and GND pin caused by the presence of a foreign object may result in
damage to the IC.
5) Operation in a strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Thermal shutdown circuit (TSD circuit)
This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to prevent runaway
thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of the thermal
shutdown circuit is assumed.
7) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting
or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process.
8) Common impedance
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as possible
(by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance).
26/29
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