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参数资料
型号： BX80536GE2266FJ
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2260 MHz, MICROPROCESSOR, CPGA478
封装： FLIP CHIP, MICRO PGA-478
文件页数： 21/30页
文件大小： 887K
代理商： BX80536GE2266FJ
Datasheet
3
Contents
1
Introduction.................................................................................................................................... 7
1.1
Terminology .................................................................................................................................. 8
1.2
References ................................................................................................................................... 9
2
Low Power Features.................................................................................................................... 11
2.1
Clock Control and Low Power States ......................................................................................... 11
2.1.1
Normal State.................................................................................................................. 11
2.1.2
AutoHALT Powerdown State ......................................................................................... 11
2.1.3
Stop-Grant State............................................................................................................ 12
2.1.4
HALT/Grant Snoop State............................................................................................... 12
2.1.5
Sleep State .................................................................................................................... 12
2.1.6
Deep Sleep State...........................................................................................................13
2.1.7
Deeper Sleep State ....................................................................................................... 13
2.2
Enhanced Intel SpeedStep Technology ................................................................................... 14
2.3
FSB Low Power Enhancements ................................................................................................. 15
2.4
Processor Power Status Indicator (PSI#) Signal ........................................................................ 15
3
Electrical Specifications ............................................................................................................. 17
3.1
Power and Ground Pins.............................................................................................................. 17
3.2
FSB Clock (BCLK[1:0]) and Processor Clocking ........................................................................ 17
3.3
Voltage Identification .................................................................................................................. 17
3.4
Catastrophic Thermal Protection ................................................................................................ 18
3.5
Signal Terminations and Unused Pins........................................................................................ 19
3.6
FSB Frequency Select Signals (BSEL[1:0]) ............................................................................... 19
3.7
FSB Signal Groups ..................................................................................................................... 19
3.8
CMOS Signals ............................................................................................................................ 20
3.9
Maximum Ratings ....................................................................................................................... 21
3.10
Processor DC Specifications ...................................................................................................... 21
4
Package Mechanical Specifications and Pin Information ....................................................... 27
4.1
Processor Pinout and Pin List..................................................................................................... 35
4.2
Alphabetical Signals Reference.................................................................................................. 51
5
Thermal Specifications and Design Considerations................................................................ 59
5.1
Thermal Specifications ............................................................................................................... 61
5.1.1
Thermal Diode ............................................................................................................... 61
5.1.2
Thermal Diode Offset..................................................................................................... 61
5.1.3
Intel Thermal Monitor................................................................................................... 62
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相关代理商/技术参数
参数描述
BX80536NC1700EJ 制造商:Intel 功能描述:MPU CELERON PROCESSOR 390 RISC 64-BIT 90NM 1.7GHZ 1.05V - Boxed Product (Development Kits)
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BX80537T5600 S L9SG 制造商:Intel 功能描述:MPU Core?2 Duo Processor T5600 64-Bit 65nm 1.83GHz 1.05V 478-Pin FCPGA6
BX80537T5600 S L9U3 制造商:Intel 功能描述:MPU Core?2 Duo Processor T5600 64-Bit 65nm 1.83GHz 1.05V 478-Pin uFCPGA
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