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参数资料
| 型号： | BX80552641T |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 40/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552641T |
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Datasheet
39
Package Mechanical Specifications
3
Package Mechanical
Specifications
The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a processor core
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions,
such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they
are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details
on the LGA775 socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Guidelines on potential IHS flatness variation with socket load plate actuation and installation
of the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Figure 3-1. Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate
相关PDF资料 |
PDF描述 |
|---|---|
| BX80552641T2 | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX805555060P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805555080P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805555080A | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805555030P | 64-BIT, MICROPROCESSOR, BGA771 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552641T2 | 制造商:Intel 功能描述:P4 641 3.2GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
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