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参数资料
| 型号： | BX80552641T |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 84/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552641T |
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Datasheet
79
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
5.1
Processor Thermal Specifications
The Pentium 4 processor requires a thermal solution to maintain temperatures within the operating
limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Intel
Pentium D Processor, Intel Pentium Processor Extreme Edition, and Intel Pentium 4
Processor Thermal and Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on
the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the Intel Pentium D
Processor, Intel Pentium Processor Extreme Edition, and Intel Pentium 4 Processor Thermal
and Mechanical Design Guidelines.
The Pentium 4 processor uses a methodology for managing processor temperatures that is intended
to support acoustic noise reduction through fan speed control. Selection of the appropriate fan
speed will be based on the temperature reported by the processor’s Thermal Diode. If the diode
temperature is greater than or equal to TCONTROL then the processor case temperature must remain
at or below the temperature as specified by the thermal profile. If the diode temperature is less than
TCONTROL then the case temperature is permitted to exceed the thermal profile, but the diode
temperature must remain at or below TCONTROL. Systems that implement fan speed control must
be designed to take these conditions into account. Systems that do not alter the fan speed only need
to ensure the case temperature meets the thermal profile specifications.
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| BX805555060P | 64-BIT, MICROPROCESSOR, BGA771 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552641T2 | 制造商:Intel 功能描述:P4 641 3.2GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
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