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| 型号： | BX80552641T |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 88/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552641T |
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82
Datasheet
Thermal Specifications and Design Considerations
5.1.2
Thermal Metrology
This temperature specification is meant to help ensure proper operation of the processor. Figure 5-2
illustrates where Intel recommends TC thermal measurements should be made. For detailed
guidelines on temperature measurement methodology, refer to the Intel Pentium D Processor,
Intel Pentium Processor Extreme Edition, and Intel Pentium 4 Processor Thermal and
Mechanical Design Guidelines.
5.2
Processor Thermal Features
5.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the thermal
control circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption by modulating (starting and stopping) the internal
processor core clocks. The Thermal Monitor feature must be enabled for the processor to be
operating within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped in the
normal manner, and interrupt requests are latched (and serviced during the time that the clocks are
on) while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30–50%). Clocks often will not be off for more than
3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will
decrease as processor core frequencies increase. A small amount of hysteresis has been included to
prevent rapid active/inactive transitions of the TCC when the processor temperature is near its
Figure 5-2. Case Temperature (TC) Measurement Location
37.5 mm
Measure TC atthis point
(geometric centerof the package)
37
.5
m
37.5 mm
Measure TC atthis point
(geometric centerof the package)
37
.5
m
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552641T2 | 制造商:Intel 功能描述:P4 641 3.2GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
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