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参数资料
| 型号： | BX80552641T |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 85/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552641T |
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80
Datasheet
Thermal Specifications and Design Considerations
To determine a processor's case temperature specification based on the thermal profile, it is
necessary to accurately measure processor power dissipation. Intel has developed a methodology
for accurate power measurement that correlates to Intel test temperature and voltage conditions.
Refer to the Intel Pentium D Processor, Intel Pentium Processor Extreme Edition, and Intel
Pentium 4 Processor Thermal and Mechanical Design Guidelines and the Processor Power
Characterization Methodology for the details of this methodology.
The case temperature is defined at the geometric top center of the processor. Analysis indicates that
real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained time periods. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power
consumption. The Thermal Monitor feature is designed to protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained periods of time. For
more details on the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum TC
(°C)
Maximum TC (°C)
Notes
631
3 GHz
86
5
See Table 5-2 and Figure 5-1
1,2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum
power that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore,
the maximum TC will vary depending on the TDP of the individual processor. Refer to Table 5-2 and Figure 5-1for the al-
lowed combinations of power and TC.
641
3.20 GHz
86
5
See Table 5-2 and Figure 5-1
651
3.40 GHz
86
5
See Table 5-2 and Figure 5-1
661
3.60 GHz
86
5
See Table 5-2 and Figure 5-1
相关PDF资料 |
PDF描述 |
|---|---|
| BX80552641T2 | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552641T2 | 制造商:Intel 功能描述:P4 641 3.2GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
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