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参数资料
| 型号： | DC1339A |
| 厂商： | Linear Technology |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | BOARD SAR ADC LTC2302 |
| 软件下载： | QuikEval System |
| 设计资源： | DC1339A Design File DC1339A Schematic |
| 标准包装： | 1 |
| 系列： | QuikEval™ |
| ADC 的数量： | 1 |
| 位数： | 12 |
| 采样率（每秒）： | 500k |
| 数据接口： | MICROWIRE?，串行，SPI? |
| 输入范围： | ±VREF/2 |
| 在以下条件下的电源（标准）： | 14mW @ 500kSPS |
| 已用 IC / 零件： | LTC2302 |
| 已供物品： | 板 |
| 相关产品： | LTC2302IDD#TRPBF-ND - IC ADC 12-BIT 1CH 500KSPS 10DFN LTC2302IDD#PBF-ND - IC ADC 12BIT 1CH 500KSPS 10-DFN LTC2302CDD#TRPBF-ND - IC ADC 12-BIT 1CH 500KSPS 10DFN LTC2302CDD#PBF-ND - IC ADC 12BIT 1CH 500KSPS 10-DFN |
LTC2302/LTC2306
19
23026fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
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